Publications associées à Soude sachet

Nanoliter Liquid Packaging in a Bioresorbable Microsystem by Additive Manufacturing and its Application as a Controlled Drug Delivery Device

Jürgen Brugger, Arnaud Bertsch, Cristina Martin Olmos, Jongeon Park

Precise packaging of nanoliter amounts of liquid in a microsystem is important for many biomedical applications. However, existing liquid encapsulation technologies have limitations in terms of liquid waste, evaporation, trapped bubbles, and liquid degrada ...

2023

Wafer-Level Vacuum Sealing for Packaging of Silicon Photonic MEMS

Niels Quack, Hamed Sattari, Alain Yuji Takabayashi, Göran Stemme

Silicon (Si) photonic micro-electro-mechanical systems (MEMS), with its low-power phase shifters and tunable couplers, is emerging as a promising technology for large-scale reconfigurable photonics with potential applications for example in photonic accele ...

SPIE-INT SOC OPTICAL ENGINEERING2021

Encapsulant Selection for PID Resistant Modules Made with Heterojunction Solar Cells

Christophe Ballif, Alessandro Francesco Aldo Virtuani, Luca Gnocchi

Recent studies showed that SHJ solar cells can be prone to PID when encapsulated with a low volume resistivity encapsulant, such as ethylene vinyl acetate (EVA). These studies also demonstrated that their degradation mechanism is different from Al-BSF modu ...

EU PVSEC Proceedings2020

Glass-free lightweight PV building elements: solutions to minimize weight and maximize durability

Ana Cristina Oliveira Martins

In densely populated countries, little free land is available for the deployment of photovoltaics (PV) in field installations. In addition, 40% of the world's demand for electricity is related to buildings. These facts provide a strong argument for the acc ...

EPFL2019

Low-temperature thin-film indium bonding for reliable wafer-level hermetic MEMS packaging

Nico de Rooij, Danick Briand, Yves Pétremand

This paper reports on low-temperature and hermetic thin-film indium bonding for wafer-level encapsulation and packaging of delicate and temperature sensitive devices. This indium-bonding technology enables bonding of surface materials commonly used in MEMS ...

Institute of Physics2013

Nonparametric Construction of Multivariate Kernels

Victor Panaretos, Kjell Konis

We propose a nonparametric method for constructing multivariate kernels tuned to the configuration of the sample, for density estimation in R-d, d moderate. The motivation behind the approach is to break down the construction of the kernel into two parts: ...

American Statistical Association2012

Encapsulation hermétique pour systèmes hydro- et thermo-sensibles

Frank Seigneur

The quantity of MEMS manufacturers has considerably been increasing these last years. This doesn't mean that the introduction of such products on the market has become easier. A packaging operation is needed to obtain a usable product out of a microsystem. ...

EPFL2009