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Publications associées (26)

Reliability Aspects of Microelectromechanical Systems for Space Applications : Mechanical Properties of Structural Materials and Analysis of Packaging Strains

Tobias Bandi

Microelectromechanical systems (MEMS) are an essential ingredient in many technological innovations and a source of game-changing inventions in the automotive industry, space exploration, consumer electronics and medical applications due to its capability ...

EPFL2014

Amorphous silicon enhanced metal-insulator-semiconductor contacts for silicon solar cells

Aïcha Hessler-Wyser, Stefaan De Wolf, Bénédicte Demaurex

Carrier recombination at the metal-semiconductor contacts has become a significant obstacle to the further advancement of high-efficiency diffused-junction silicon solar cells. This paper provides the proof-of-concept of a procedure to reduce contact recom ...

American Institute of Physics2014

Passivating contacts for homojunction solar cells using a-Si:H/c-Si hetero-interfaces

Bénédicte Demaurex

Crystalline silicon (c-Si) homojunction solar cells account for over 90% of the current photovoltaic market. However, further progress of this technology is limited by recombinative losses occurring at their metal-semiconductor contacts. The goal of this t ...

EPFL2014

3D-Integration of a Carbon Nanotube based RF-NEMS

Rokhaya Gueye

In the framework of the NanoTera project CabTuRes, a system-in-package for a nano-resonator was proposed, integrating CMOS driving electronics and vacuum encapsulation. This doctoral research aimed to investigate 3D-integration technologies for a Single-Wa ...

EPFL2013

Thermal Simulation of Liquid-Cooled Integrated Circuits

Arvind Raj Mahankali Sridhar

Growing demands for increased functionality in consumer electronics and for information technology-enabled services in various sectors have resulted in the rise of high-performance multiprocessor system-on-chips (MPSoCs) and three-dimensionally stacked int ...

EPFL2013

High-temperature compatible 3D-integration processes for a vacuum-sealed CNT-based NEMS

Nico de Rooij, Danick Briand, Terunobu Akiyama, Rokhaya Gueye

A System-in-Package (SiP) concept for the 3D-integration of a Single Wall Carbon Nanotube (SWCNT) resonator with its CMOS driving electronics is presented. The key element of this advanced SiP is the monolithic 3D-integration of the MEMS with the CMOS elec ...

SPIE - International Society of Optical Engineering2013

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