Publications associées à Brasage

Molybdenum disulphide nanoporous membranes as nanofluidic platforms - large-area engineering and study

The work demonstrated in this thesis represent the path towards developing the large-scale fabrication of two-dimensional nanoporous membrane devices and use thereof as platforms to study nanoscale physics of water and ion flow through confined channels. M ...

EPFL2022

Hybrid soft-rigid electrical interconnection system

Stéphanie Lacour, Giuseppe Schiavone, Florian Dylan Fallegger

It is disclosed an electrical interconnection system comprising: i) an interconnection board comprising an intrinsically non elastic substrate, said substrate having a first face and an opposed second face, and at least one conductive track on and/or withi ...

2021

First principles study of the effect of hydrogen in austenitic stainless steels and high entropy alloys

William Curtin, Xiao Zhou

Hydrogen (H) embrittlement in multicomponent austenitic alloys is a serious limitation to their application in many environments. Recent experiments show that the High-Entropy Alloy (HEA) CoCrFeMnNi absorbs more H than 304 Stainless Steel but is less prone ...

2020

Preliminary Tests of Soldered and Diffusion-Bonded Splices Between Nb3Sn Rutherford Cables for Graded High-Field Accelerator Magnets

Pierluigi Bruzzone, Davide Uglietti, Mithlesh Kumar, Vincenzo D'Auria

High-field accelerator magnets of the next generation will require coil grading in order to decrease the amount of superconductor and hence the magnet cost. The joints between Nb3Sn conductor grades must have low electrical resistance (

IEEE Institute of Electrical and Electronics Engineers2019

Development of a new family of phosphorous-free Pt-based bulk metallic glasses

Ludger Weber, Maïté Blank, Hamed Kazemi, Cyrill Werner Cattin

New BMGs exhibiting strong glass forming ability combined with high hardness have been developed based on the Pt-Si-B ternary system. The effects of partial substitution of platinum by transition metals of the group iron, cobalt, nickel, and copper, as wel ...

Elsevier2017

HTS high current cable for fusion application

Nikolay Bykovskiy

State-of-the-art magnets of fusion devices, which are based on low temperature superconductors (LTS), have almost reached their technological limits in terms of generated magnetic fields. Further progress can be made using novel high temperature supercondu ...

EPFL2017

Multi-scale modeling of elasto-plastic response of SnAgCu lead-free solder alloys at different ageing conditions: Effect of microstructure evolution, particle size effects and interfacial failure

John Botsis, Joël Cugnoni, Milad Maleki

In microelectronics applications, SnAgCu lead-free solder joints play the important role of ensuring both the mechanical and electrical integrity of the components. In such applications, the SnAgCu joints are subjected to elevated homologous temperatures f ...

Elsevier2016

Microstructure and tensile properties of ODS ferritic steels mechanically alloyed with Fe 2 Y

Nadine Baluc, Philippe Spätig

An oxide dispersion strengthened ODS ferritic steel has been produced by mechanical alloying of Fe–14Cr–2W–0.2Ti (wt.%) prealloyed powder with 0.55 (wt.%) Fe2Y intermetallic particles and consolidated by hot isostatic pressing. The microstructure after the ...

Elsevier2016

Steel-Concrete Connections by Adhesion, Interlocking, and Friction for Composite Bridges under Cyclic Loading

Jean-Paul Lebet, Dimitrios Papastergiou

This paper deals with of a new type of steel-concrete connection for composite beams. The connection is an alternative solution for steel-concrete composite bridges suitable for prefabrication and fast erection. The composite action of the beam is establis ...

ASCE2016

Mechanical and microstructural characteristics of Ti6Al4V/AA2519 and Ti6Al4V/AA1050/AA2519 laminates manufactured by explosive welding

Marco Cantoni

The aim of the work was to produce laminated structures consisting of Ti-6Al-4V alloy and AA2519 plates and to investigate their microstructure and mechanical properties with anemphasis on the role of an additional AA1050 interlayer. Explosive welding was ...

Elsevier Sci Ltd2016

Optimisation of industrial production of low-force sensors – adhesive bonding of force-centring ball

Peter Ryser, Thomas Maeder, Caroline Jacq, Maxime Blot

This work addresses the issue of attaching the force-centring part (a round ball) to the load cell of a force sensor, a piezoresistive thick-film Wheatstone bridge deposited onto a ceramic cantilever. As the current soldering process requires expensive met ...

IOP2015

Isothermal Ageing of SnAgCu Solder Alloys: Three-Dimensional Morphometry Analysis of Microstructural Evolution and Its Effects on Mechanical Response

John Botsis, Joël Cugnoni, Milad Maleki

Due to the high homologous temperature and fast cooling rates, the microstructures of SnAgCu (SAC) solders are in a meta-stable state in most applications, which is the cause of significant microstructural evolution and continuous variation in the mechanic ...

Springer2014

Microstructure-based modeling of the ageing effect on the deformation behavior of the eutectic micro-constituent in SnAgCu lead-free solder

John Botsis, Joël Cugnoni, Milad Maleki

The eutectic micro-constituent in SnAgCu solder governs the deformation behavior of the joint as it shows better deformation resistance than the Sn dendrites and occupies a high volume percentage of the whole solder. The main scope of this study is to deve ...

Elsevier2013

Integration of Intra Chip Stack Fluidic Cooling using Thin-Layer Solder Bonding

John Richard Thome, Michail Zervas, Yusuf Leblebici, Yassir Madhour, Bruno Michel

Three-dimensional (3D) stacking of integrated circuit (IC) dies by vertical integration increases system density and package functionality. The vertical integration of IC dies by area-array Through-Silicon-Vias (TSVs) reduces the length of global interconn ...

IEEE2013

Wetting Behavior of Ternary Au-Ge-X (X = Sb, Sn) Alloys on Cu and Ni

Christian Leinenbach, Shan Jin

Au-Ge-based alloys are potential substitutes for Pb-rich solders currently used for high-temperature applications. In the present work, the wetting behavior of two Au-Ge-X (X = Sb, Sn) ternary alloys, i.e., Au-15Ge-17Sb and Au-13.7 Ge-15.3Sn (at.%), in con ...

Springer2013

Integrated packaging solutions and hotplates for a miniature atomic clock and other microsystems

Fabrizio Vecchio

This thesis aimed at developing innovative packaging solutions for a miniature atomic clock and other microsystems in the cm-scale, i.e. somewhat larger than what is practical for full "chip-scale" device-package integration using clean-room technologies f ...

EPFL2013

Review of Bi2O3-based glasses for electronics and related applications

Thomas Maeder

The present work critically reviews the scientific and patent literature on low-melting bismuth-based oxide glass frits in materials for electronics, sensors and related applications such as sealing glasses, solar cells, architectural and automotive glass, ...

Maney Publishing2013

Deformation and Damage in Lead-free Solder Joints : Microstructure-based Modeling and Experimental Characterization

Milad Maleki

For environmental reasons, lead has been banned from microelectronic solder materials since the adoption of the RoHS legislation in 2006. A large number of investigations have lead to the development of new lead-free solder materials like the SnAgCu alloy ...

EPFL2012

On the Mutual Effect of Viscoplasticity and Interfacial Damage Progression in Interfacial Fracture of Lead-Free Solder Joints

John Botsis, Joël Cugnoni, Milad Maleki

The main goal of this paper is to shed light on the effect of strain rate and viscoplastic deformation of bulk solder on the interfacial failure of lead-free solder joints. For this purpose, interfacial damage evolution and mode I fracture behavior of the ...

Springer US2011

Mechanical and microstructural integrity of nickel-titanium and stainless steel laser joined wires

Michel Rappaz, Aïcha Hessler-Wyser, Alireza Karimi, Jean-Marie Drezet, Jonas Vannod

The biomedical industry shows increasing interest in the joining of dissimilar metals, especially with the aim of developing devices that combine different mechanical and corrosive properties. As an example, nickel titanium shape memory alloys joined to st ...

Elsevier2011