Publications associées à Linear integrated circuit

The 2024 Magnonics Roadmap

Dirk Grundler, Thomas Yu, Ping Che, Qi Wang, Wei Zhang, Benedetta Flebus

Magnonics is a research field that has gained an increasing interest in both the fundamental and applied sciences in recent years. This field aims to explore and functionalize collective spin excitations in magnetically ordered materials for modern informa ...

2024

Cascaded all-optical quantization employing step-size MMI and shape-optimized power splitter

Jijun He, Xiaowei Zhang, Jian Wu, Ye Tian

As a key unit of future high-throughput communications, optical analog to digital converter (OADC) with all-optical quantizer element that simultaneously possesses high resolution, large bandwidth and compact size is highly promising. A pending issue of co ...

ELSEVIER SCI LTD2023

In Liquido Computation with Electrochemical Transistors and Mixed Conductors for Intelligent Bioelectronics

Matteo Cucchi, Eleni Stavrinidou

Next-generation implantable computational devices require long-term-stable electronic components capable of operating in, and interacting with, electrolytic surroundings without being damaged. Organic electrochemical transistors (OECTs) emerged as fitting ...

Wiley-V C H Verlag Gmbh2023

Exploring brain-inspired multi-core heterogeneous hardware templates for low-power biomedical embedded systems

Benoît Walter Denkinger

The miniaturization of integrated circuits (ICs) and their higher performance and energy efficiency, combined with new machine learning algorithms and applications, have paved the way to intelligent, interconnected edge devices. In the medical domain, they ...

EPFL2023

Evaluating, Exploiting, and Hiding Power Side-Channel Leakage of Remote FPGAs

Ognjen Glamocanin

The pervasive adoption of field-programmable gate arrays (FPGAs) in both cyber-physical systems and the cloud has raised many security issues. Being integrated circuits, FPGAs are susceptible to fault and power side-channel attacks, which require physical ...

EPFL2023

Integrated Electronics for Deep Implants to Remotely Monitor Hemodynamics

Mustafa Besirli

The integration of technology in the medical field has greatly improved accuracy in diagnoses, thus leading to more effective treatments. Wearable and implantable medical devices offer great potential for remote patient monitoring, particularly for heart f ...

EPFL2023

2D Nanosystems: Applications of 2D Semiconductors for In-Memory Computing

Guilherme Migliato Marega

Machine learning and data processing algorithms have been thriving in finding ways of processing and classifying information by exploiting the hidden trends of large datasets. Although these emerging computational methods have become successful in today's ...

EPFL2023

Source Reconstruction Method Using Phase-Less Magnetic Near-Field Measurements: Application of the Method of Moment with Roof-Top Basis Functions

Marcos Rubinstein, Hamidreza Karami

Source reconstruction methods have many applications such as antenna diagnosis, calculating far-field radiated emissions, and identifying incompatible sources on integrated circuits or printed circuit boards. In this paper, the Gerchberg-Saxton algorithm i ...

IEEE2022

New Insights for Parasitic Effects of Label-Free Biosensors Based on Capacitive Micromachined Ultrasonic Transducers

Sandro Carrara, Zhengwen Jiang, Yihe Zhao, Jie Li

Capacitive micromachined ultrasonic transducers (CMUTs) are regarded as an attractive candidate in bio-applications such as imaging and molecule monitoring. However, the previous researches on biochemical sensing are mostly air-coupled application based on ...

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC2022

Influence of Fin and Finger Number on TID Degradation of 16-nm Bulk FinFETs Irradiated to Ultrahigh Doses

Christian Enz

This article investigates the fin- and finger-number dependence of the total ionizing dose (TID) degradation in 16-nm bulk Si FinFETs at ultrahigh doses. n- and p-FinFETs designed with different numbers of fins and fingers are irradiated up to 500 Mrad(SiO ...

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC2022

A Deep-Learning Approach to Side-Channel Based CPU Disassembly at Design Time

Mirjana Stojilovic

Side-channel CPU disassembly is a side-channel attack that allows an adversary to recover instructions executed by a processor. Not only does such an attack compromise code confidentiality, it can also reveal critical information on the system’s internals. ...

IEEE2022

Thermal and Power-Aware Run-Time Performance Management of 3D MPSoCs with Integrated Flow Cell Arrays

David Atienza Alonso, Giovanni Ansaloni, Marina Zapater Sancho, Alexandre Sébastien Julien Levisse, Halima Najibi

Flow Cell Arrays (FCA) technology employs microchannels filled with an electrolytic fluid to concurrently provide cooling and power generation to integrated circuits (ICs). This solution is particularly appealing for Three-Dimensional Multi-Processor Syste ...

2022

Near-junction microfluidic cooling for high power-density GaN-on-Si electronics: A wafer, device, packaging, and system-level investigation

Remco Franciscus Peter van Erp

Electrification of the energy section, from generation to end-use, plays an essential role in reducing global CO2 emission. Innovations in power electronics are required to increase conversion efficiency and power density. Gallium nitride (GaN) transistors ...

EPFL2022

Strategies, Techniques and Systems for powering low-maintenance and battery-free devices through Energy Harvesting and Wireless Power Transfer

Roberto La Rosa

The purpose of this research has a background in the market for Internet of Things (IoT)devices and wireless sensor networks. The Market Forecast predicts the connection of a trillion"things" by 2025. The global smart sensor market size trend grows from US ...

EPFL2022

Thermal and Voltage-Aware Performance Management of 3D MPSoCs with Flow Cell Arrays and Integrated SC Converters

David Atienza Alonso, Marina Zapater Sancho, Giovanni Ansaloni, Alexandre Sébastien Julien Levisse, Halima Najibi

Flow cell arrays (FCAs) concurrently provide efficient on-chip liquid cooling and electrochemical power generation. This technology is especially promising for three-dimensional multi-processor systems-on-chip (3D MPSoCs) realized in deeply scaled technolo ...

2022

Fully self-contained turn-key soliton microcomb source

Tobias Kippenberg, Rui Ning Wang, Grigorii Likhachev, Junqiu Liu, Jijun He, John David Jost, Arslan Sajid Raja

We demonstrate a turn-key microcomb source based on 100 GHz Si3N4 ring microresonator. The device is fully optically and electronically integrated in a compact box, which runs by pushing one button. ...

IEEE2021

Resource Trade-Offs in Circuits and Systems: from Neurotechnology to Communications

Arda Uran

This thesis aims to explore and exploit trade-offs in integrated circuits and systems to overcome the fundamental bottlenecks faced by future data acquisition and communication systems. Specifically, we target the emerging implantable neurotechnology and t ...

EPFL2021

Nanowatt Acoustic Inference Sensing Exploiting Nonlinear Analog Feature Extraction

Christian Enz, Minhao Yang, Jun Zhang

Ultralow-power sensing with inference functionality embedded in sensor nodes is essential for enabling the emerging pervasive intelligence. For acoustic inference sensing, the feature extraction can take advantage of power-efficient analog circuits. Howeve ...

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC2021

Characterization and Verification of Eddy-Current Position Sensing for Magnetic Levitation

Yves Perriard, Sean Thomas, Juan Patricio Tomás Peralta Fierro

Magnetically-levitated drives are compelling in applications where the long-lifetime operation or process chamber encapsulation is a requirement. To exploit these advantages, contactless position sensors are needed to estimate the position of the rotor. Of ...

2021

Embedded Microchannel Cooling for Monolithically-integrated GaN Half-bridge ICs

Elison de Nazareth Matioli, Remco Franciscus Peter van Erp, Luca Nela, Palliyage Srilak Nirmana Perera

Efficient and compact power conversion is a key requirement to achieve sustainable electrification of our society. GaN-based power devices offer major benefits compared to their silicon counterparts in terms of efficiency and integration but suffer from se ...

IEEE2021