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Publications associées (31)

A Compressive Sensing Framework for EMI Source Localization Using a Metalens Structure: Localization Beyond the Diffraction Limit

Marcos Rubinstein, Mohammad Azadifar, Farhad Rachidi-Haeri, Hamidreza Karami

In this article, we propose a novel approach for the localization of electromagnetic interference (EMI) sources based on the concept of compressive sensing and metalenses. We show that using the spatial and frequency dispersion offered by the metalens, we ...

2022

Design and printing of a coplanar capacitive proximity sensor to detect the gap between dielectric foils edges

Danick Briand, Rubaiyet Iftekharul Haque, Martin Lubej

This paper presents the design and development of a coplanar capacitive proximity sensor for the detection of the gap between the edges of dielectric foils. The finite element analysis is applied to study the design of the sensor by investigating the effec ...

2022

A Battery-Free Wireless Smart Sensor platform with Bluetooth Low Energy Connectivity for Smart Agriculture

Catherine Dehollain, Roberto La Rosa

Smart agriculture systems, which integrate sensors and data analysis into agricultural production processes, are increasingly proving an effective solution for reducing food production waste, yield production increase, and product quality improvement. In t ...

IEEE2022

3D printing of elastomeric mechanical sensors designed for human motion monitoring

Ryan Mitchell van Dommelen

In this thesis several advances are made to the emerging field of 3D printed mechanical sensors. Techniques and processes were developed to enable the integration of highly conductive, and capacitive and piezoresistive sensing features embedded within 3D p ...

EPFL2022

Hybrid soft-rigid electrical interconnection system

Stéphanie Lacour, Giuseppe Schiavone, Florian Dylan Fallegger

It is disclosed an electrical interconnection system comprising: i) an interconnection board comprising an intrinsically non elastic substrate, said substrate having a first face and an opposed second face, and at least one conductive track on and/or withi ...

2021

Characterization of Microwave Substrates for High Accuracy and Long-Term Stability Using Full-Wave Microstrip Ring Resonator Method

Anja Skrivervik, Miroslav Veljovic, Yuanyan Su

An accurate material characterization method for microwave printed-circuit-board substrates is proposed by combining the microwave ring resonator method with iterative full-wave simulations. A detailed error analysis is performed quantitatively to compensa ...

IEEE2021

2D Material Based Inks For Room Temperature Printed Electronics

Sina Abdolhosseinzadeh

Functional printing is a versatile mass production method that has gained considerable scientific and industrial attention in the past few years. A wide range of electronics from passive circuit components (e.g., resistors and interconnects) to high-perfor ...

EPFL2021

A Self-powered Ambient Light Power Measurement Platform with Time-domain Readout

Catherine Dehollain, Roberto La Rosa

Internet of Things (IoT) provides more and more adequate infrastructures for many applications and advanced services. This scenario promotes the ability to satisfy the growing demand for innovative measuring systems, increasingly popular consisting of inte ...

IEEE2021

An Energy-Autonomous Wireless Sensor With Simultaneous Energy Harvesting and Ambient Light Sensing

Andreas Peter Burg, Catherine Dehollain, Roberto La Rosa

Wireless sensor nodes (WSNs) are generally powered by batteries, which results in a substantial limitation to the places where the nodes can be installed, to the maximum number of deployable devices, and to the node lifetime. To meet the demand for Interne ...

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC2021

In-situ laser sintering for the fabrication of fully 3D printed electronics composed of elastomeric materials

Danick Briand, Rubaiyet Iftekharul Haque, Sébastien Lani, Ryan Mitchell van Dommelen, Olivier Rémy Henry Chandran

In-situ laser sintering can be used to locally sinter conductive inks in an uninterrupted process, enabling the embedding of printed electronics within 3D printed structures. In this work we apply a laser sintering method to create highly conductive silver ...

2021

Sommerfeld Integrals and Their Relation to the Development of Planar Microwave Devices

Krzysztof Michalski, Juan Ramon Mosig

This paper deals with the mathematical expressions called Sommerfeld integrals. Introduced by A. Sommerfeld in 1909, they are mathematically equivalent to inverse Hankel transforms. The original historical goal of these integrals was to provide an accurate ...

Ieee-Inst Electrical Electronics Engineers Inc2021

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