Michel Rappaz, Aïcha Hessler-Wyser, Léa Deillon, Thierry Hessler
Au-In bonds with a nominal composition of about 60 at.% In were fabricated for use in wafer-level packaging of MEMS. The microstructure of the bonds was studied by scanning electron microscopy. The bond hermeticity was then assessed using oxidation of Cu t ...
Institute of Physics2015
