Publications de Göran Stemme | EPFL Graph Search

A 3D-Printed Functional Mems Accelerometer

Göran Stemme, Luis Guillermo Villanueva Torrijo, Damien Maillard, Simone Pagliano

3D printing of MEMS devices could enable the cost-efficient production of custom-designed and complex 3D MEMS for prototyping and for low-volume applications. In this work, we present the first micro 3D-printed functional MEMS accelerometers using two-phot ...

IEEE2023

Micro 3D printing of a functional MEMS accelerometer

Göran Stemme, Luis Guillermo Villanueva Torrijo, Damien Maillard, Simone Pagliano

Microelectromechanical system (MEMS) devices, such as accelerometers, are widely used across industries, including the automotive, consumer electronics, and medical industries. MEMS are efficiently produced at very high volumes using large-scale semiconduc ...

SPRINGERNATURE2022

Wafer-Level Vacuum Sealing for Packaging of Silicon Photonic MEMS

Niels Quack, Göran Stemme, Hamed Sattari, Alain Yuji Takabayashi

Silicon (Si) photonic micro-electro-mechanical systems (MEMS), with its low-power phase shifters and tunable couplers, is emerging as a promising technology for large-scale reconfigurable photonics with potential applications for example in photonic accele ...

SPIE-INT SOC OPTICAL ENGINEERING2021

Through-Glass Vias for Glass Interposers and MEMS Packaging Applications Fabricated Using Magnetic Assembly of Microscale Metal Wires

Göran Stemme, Mikhail Asiatici

A through-glass via (TGV) provides a vertical electrical connection through a glass substrate. TGVs are used in advanced packaging solutions, such as glass interposers and wafer-level packaging of microelectromechanical systems (MEMS). However, TGVs are ch ...

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC2018

Through Silicon Vias With Invar Metal Conductor for High-Temperature Applications

Göran Stemme, Mikhail Asiatici

Through silicon vias (TSVs) are key enablers of 3-D integration technologies which, by vertically stacking and interconnecting multiple chips, achieve higher performances, lower power, and a smaller footprint. Copper is the most commonly used conductor to ...

Institute of Electrical and Electronics Engineers2017

Capacitive inertial sensing at high temperatures of up to 400 degrees C

Göran Stemme, Mikhail Asiatici

High-temperature-resistant inertial sensors are increasingly requested in a variety of fields such as aerospace, automotive and energy. Capacitive detection is especially suitable for sensing at high temperatures due to its low intrinsic temperature depend ...

Elsevier Science Sa2016