Publications de Ayse Kivilcim Coskun

ECOGreen: Electricity Cost Optimization for Green Datacenters in Emerging Power Markets

David Atienza Alonso, Ayse Kivilcim Coskun, Ali Pahlevan, Marina Zapater Sancho

Modern datacenters need to tackle efficiently the increasing demand for computing resources while minimizing energy usage and monetary costs. Power market operators have recently introduced emerging demand-response programs, in which electricity consumers ...

2021

Design Optimization of 3D Multi-Processor System-on-Chip with Integrated Flow Cell Arrays

David Atienza Alonso, Ayse Kivilcim Coskun, Artem Andreev, Marina Zapater Sancho, Fulya Kaplan

Integrated flow cell array (FCA) is an emerging technology, targeting the cooling and power delivery challenges of modern 2D/3D Multi-Processor Systems-on-Chip (MPSoCs). In FCA, electrolytic solutions are pumped through microchannels etched in the silicon ...

2018

GreenCool: An Energy-Efficient Liquid Cooling Design Technique for 3-D MPSoCs Via Channel Width Modulation

David Atienza Alonso, Ayse Kivilcim Coskun, Arvind Raj Mahankali Sridhar, Jie Meng

Liquid cooling using interlayer microchannels has appeared as a viable and scalable packaging technology for 3-D multiprocessor system-on-chips (MPSoCs). Microchannel-based liquid cooling, however, can substantially increase the on-chip thermal gradients, ...

Institute of Electrical and Electronics Engineers2013

3D-MMC: A Modular 3D Multi-Core Architecture with Efficient Resource Pooling

Yusuf Leblebici, Ayse Kivilcim Coskun, Panagiotis Athanasopoulos, Alessandro Cevrero, Giulia Beanato

2013

Attaining Single-Chip, High-Performance Computing Through 3D Systems with Active Cooling

David Atienza Alonso, Ayse Kivilcim Coskun, Mohamed Mostafa Sabry Aly, Jie Meng

Three-dimensional (3D) stacking is an attractive method for designing large manycore chips as it provides high transistor integration densities, improves manufacturing yield due to smaller chip area, reduces wirelength and capacitance, and enables heteroge ...

Institute of Electrical and Electronics Engineers2011

Energy-Efficient Multi-Objective Thermal Control for Liquid-Cooled 3D Stacked Architectures

David Atienza Alonso, Ayse Kivilcim Coskun, Mohamed Mostafa Sabry Aly

3D stacked systems reduce communication delay in multiprocessor system-on-chips (MPSoCs) and enable heterogeneous integration of cores, memories, sensors, and RF devices. However, vertical integration of layers exacerbates temperatureinduced problems such ...

Institute of Electrical and Electronics Engineers2011

Thermal Analysis and Active Cooling Management for 3D MPSoCs

David Atienza Alonso, Ayse Kivilcim Coskun

3D stacked architectures reduce communication delay in multiprocessor system-on-chips (MPSoCs) and allowing more functionality per unit area. However, vertical integration of layers exacerbates the reliability and thermal problems, and cooling is a limitin ...

IEEE Press2011

Energy-Efficient Variable-Flow Liquid Cooling in 3D Stacked Architectures

David Atienza Alonso, Ayse Kivilcim Coskun, Bruno Michel

Liquid cooling has emerged as a promising solution for addressing the elevated temperatures in 3D stacked architectures. In this work, we first propose a framework for detailed thermal modeling of the microchannels embedded between the tiers of the 3D syst ...

ACM/IEEE Press2010

Fuzzy Control for Enforcing Energy Efficiency in High-Performance 3D Systems

David Atienza Alonso, Ayse Kivilcim Coskun, Mohamed Mostafa Sabry Aly

3D stacked circuits reduce communication delay in multicore system-on-chips (SoCs) and enable heterogeneous integration of cores, memories, sensors, and RF devices. However, vertical integration of layers exacerbates the reliability and thermal problems, a ...

IEEE Press2010

Dynamic Thermal Management in 3D Multicore Architectures

Yusuf Leblebici, David Atienza Alonso, Ayse Kivilcim Coskun, José Luis Ayala Rodrigo

Technology scaling has caused the feature sizes to shrink continuously, whereas interconnects, unlike transistors, have not followed the same trend. Designing 3D stack architectures is a recently proposed approach to overcome the power consumption and dela ...

IEEE and ACM2009

Modeling and Dynamic Management of 3D Multicore Systems with Liquid Cooling

David Atienza Alonso, Ayse Kivilcim Coskun, José Luis Ayala Rodrigo

Three-dimensional (3D) circuits reduce communication delay in multicore SoCs, and enable efficient integration of cores, memories, sensors, and RF devices. However, vertical integration of layers exacerbates the reliability and thermal problems, and coolin ...

IEEE/IFIP Press2009

Optimal Multi-Processor SoC Thermal Simulation via Adaptive Differential Equation Solvers

Giovanni De Micheli, David Atienza Alonso, Ayse Kivilcim Coskun, Francesco Zanini

Thermal management is a critical challenge in the design of high performance multi-processor system-on-chips (MPSoCs). Therefore, accurate and fast thermal modeling tools are necessary for efficiently analyzing the thermal profiles of MPSoCs. This paper ad ...

IEEE/IFIP Press2009

Analysis and Optimization of MPSoC Reliability

Yusuf Leblebici, Giovanni De Micheli, Ayse Kivilcim Coskun

Advancements in technology enable integration of multiple devices on a single core, resulting in increased on chip power and temperature densities. Higher temperatures, in turn, present a significant challenge for reliability. In this work we propose a com ...

2006

A Simulation Methodology for Reliability Analysis in Multi-Core SoCs

Yusuf Leblebici, Giovanni De Micheli, Ayse Kivilcim Coskun

Reliability has become a significant challenge for system design in new process technologies. Higher integration levels dramatically increase power densities, which leads to higher temperature and adverse effects on reliability. In this paper, we introduce ...

ACM Press2006