Publications associées à Optimisation of industrial production of low-force sensors – adhesive bonding of force-centring ball

A dynamic scheduling tool and a methodology for creating digital twin of manufacturing systems for achieving Zero Defect Manufacturing

Nowadays manufacturing environment is highly volatile and rapidly changing as the need of products is increasing exponentially, due to the fact that Product Life Cycle is shortened and therefore more products are required to be manufactured or remanufactur ...

EPFL2021

Virtual metrology as an approach for product quality estimation in Industry 4.0: a systematic review and integrative conceptual framework

Dimitrios Kyritsis, Gökan May, Foivos Psarommatis Giannakopoulos

Virtual metrology (VM) involves estimating a product's quality directly from production process data without physically measuring it. This enables the product quality of each unit of production to be monitored in real time, while preserving the process eff ...

TAYLOR & FRANCIS LTD2022

Industry 4.0 Technologies and Customer-centricity for Digital Supply Chains

Rachel Agnès Laetitia Rosemonde Marie Lacroix

The last few years have experienced the emergence of Industry 4.0 (I4.0), ultra-customization, and the explosion of demand for ethical, fair trade, and sustainable consumption. Organizations have therefore started a digital transformation of their SCs and ...

EPFL2021

2D Material Based Inks For Room Temperature Printed Electronics

Sina Abdolhosseinzadeh

Functional printing is a versatile mass production method that has gained considerable scientific and industrial attention in the past few years. A wide range of electronics from passive circuit components (e.g., resistors and interconnects) to high-perfor ...

EPFL2021

Large-scale kinetic metabolic models of Pseudomonas putida KT2440 for consistent design of metabolic engineering strategies

Ljubisa Miskovic, Vassily Hatzimanikatis, Milenko Tokic

Background: Pseudomonas putida is a promising candidate for the industrial production of biofuels and biochemicals because of its high tolerance to toxic compounds and its ability to grow on a wide variety of substrates. Engineering this organism for impro ...

2020

Controlling strategies to maximize reliability of integrated photo-electrochemical devices exposed to realistic disturbances

Sophia Haussener, Saurabh Yuvraj Tembhurne

We numerically investigate the conversion of solar energy into chemical energy by integrated photo-electrochemical (IPEC) devices and assess their response to time-dependent changes in the boundary conditions and the material properties. We focus on a devi ...

RSC2019

A Scheduling Tool for Achieving Zero Defect Manufacturing (ZDM): A Conceptual Framework

Dimitrios Kyritsis, Foivos Psarommatis Giannakopoulos

Contemporary manufacturing landscape has changed and has become highly volatile and demanding. Product Life Cycle has significantly decreased because of the consumers' need for personalized products in shorter period of time. This need forced the manufactu ...

SPRINGER-VERLAG BERLIN2018

Isothermal Ageing of SnAgCu Solder Alloys: Three-Dimensional Morphometry Analysis of Microstructural Evolution and Its Effects on Mechanical Response

Joël Cugnoni, John Botsis, Milad Maleki

Due to the high homologous temperature and fast cooling rates, the microstructures of SnAgCu (SAC) solders are in a meta-stable state in most applications, which is the cause of significant microstructural evolution and continuous variation in the mechanic ...

Springer2014

Integration of Intra Chip Stack Fluidic Cooling using Thin-Layer Solder Bonding

John Richard Thome, Yusuf Leblebici, Yassir Madhour, Michail Zervas, Bruno Michel

Three-dimensional (3D) stacking of integrated circuit (IC) dies by vertical integration increases system density and package functionality. The vertical integration of IC dies by area-array Through-Silicon-Vias (TSVs) reduces the length of global interconn ...

IEEE2013

Integrated packaging solutions and hotplates for a miniature atomic clock and other microsystems

Fabrizio Vecchio

This thesis aimed at developing innovative packaging solutions for a miniature atomic clock and other microsystems in the cm-scale, i.e. somewhat larger than what is practical for full "chip-scale" device-package integration using clean-room technologies f ...

EPFL2013

Deformation and Damage in Lead-free Solder Joints : Microstructure-based Modeling and Experimental Characterization

Milad Maleki

For environmental reasons, lead has been banned from microelectronic solder materials since the adoption of the RoHS legislation in 2006. A large number of investigations have lead to the development of new lead-free solder materials like the SnAgCu alloy ...

EPFL2012

Correlation of microstructural and mechanical properties in particle reinforced lead-free solders

Venkatesh Sivasubramaniam

Solders are widely used as interconnect material for the electronic industry. The solder interconnect provides both electrical contact and mechanical connection between the integrated circuit devices and their substrate. Thus solders with good reliability ...

EPFL2009

Hermetic package for optical MEMS

Thomas Maeder, Jacques Jacot, Peter Ryser, Frank Seigneur, Yannick Sébastien Fournier

This article describes the design and fabrication of a hermetic LTCC package for an optical MEMS chip designed for space applications. The package must ensure electrical and optical connections, mechanical positioning, atmosphere control, and finally low t ...

2009

Characterization of the Residual Stresses and Strength of Ceramic-Metal Braze Joints

John Botsis, Matteo Galli

Residual stress relief in ceramic-metal joints produced by active brazing depends primarily on the plastic response of the filler metal. A procedure for the production and mechanical characterization of bulk active filler alloy specimens is developed. In p ...

2009

Reliability Analysis of Lead-free Solders

Joël Cugnoni, John Botsis

In this study, a deep analysis of the reliability of lead-free (SnAgCu) solders in comparison with tin-lead solders have been done for a particular aerospace application. Creep properties of this solder composition have been investigated, and results have ...

Int Assoc Engineers-Iaeng, Unit1, 1-F, 37-39 Hung To Road, Kwun Tong, Hong Kong, 00000, Peoples R China2008