Publications associées à Engineered substrates with embedded strain relief for stretchable thin-film electronics

Modeling friction and wear using an adaptive discrete-continuum coupling

When two objects slide against each other, wear and friction occur at their interface. The accumulation of wear forms what is commonly referred to as a ``third-body''. Understanding third-body evolution has significant applications in industry, where contr ...

EPFL2024

Dataset for "Complexity of crack front geometry enhances toughness of brittle solids"

John Martin Kolinski, Chenzhuo Li, Xinyue Wei

This data package supports the publication 'Complexity of crack front geometry enhances toughness of brittle solids' by Xinyue Wei, Chenzhuo Li, Cían McCarthy, and John M. Kolinski Nature physics (2024) - https://doi.org/10.1038/s41567-024-02435-x DOI: 1 ...

Zenodo2024

Two-dimensional quasi-static delamination in composite laminates under Mode-I and Mode-II conditions

Congzhe Wang

Fiber-polymer composites consist of a polymer matrix and reinforcing fibers made of various materials. These composites exhibit exceptional properties, such as a high strength-to-weight ratio and excellent corrosion resistance, which has led to their incre ...

EPFL2024

Influence of model uncertainty and long term deformations in action effects calculation in reinforced concrete structures

Xhemsi Malja

Most codes of practice adopt a semi probabilistic design approach for the dimensioning and assessment of structures. Accordingly, structural safety is ensured by performing limit state verifications using design values determined with adequately calibrated ...

EPFL2024

Influence of fiber orientation on the tensile behavior of UHPFRC and reinforced UHPFRC under static and fatigue loadings

Jian Zhan

Ultra-high performance fiber reinforced cementitious composite (UHPFRC) is a modern class of cementitious building materials. Because of its superior mechanical properties and durability, it is increasingly used globally to rehabilitate, strengthen and mod ...

EPFL2024

Computational Homogenization for Inverse Design of Surface-based Inflatables

Mark Pauly, Francis Julian Panetta, Uday Kusupati, Yingying Ren, Florin Isvoranu, Seiichi Eduardo Suzuki Erazo

Surface-based inflatables are composed of two thin layers of nearly inextensible sheet material joined together along carefully selected fusing curves. During inflation, pressure forces separate the two sheets to maximize the enclosed volume. The fusing c ...

2024

Short-term behavior of glass fiber-polymer composite bending-active elastica beam under service load application

Thomas Keller, Landolf-Giosef-Anastasios Rhode-Barbarigos, Tara Habibi

Bending-active elastica beam is a structural configuration that is based on the elastic deformation of an initially straight beam. This deformation occurs when horizontal displacements are applied to a sliding support, causing the beam to bend into an arch ...

2024

Towards Scalable Electronics: Synthetic 2D Materials for Large-Area 2D Circuit Integration

Zhenyu Wang

In the past decades, a significant increase of the transistor density on a chip has led to exponential growth in computational power driven by Moore's law. To overcome the bottleneck of traditional von-Neumann architecture in computational efficiency, effo ...

EPFL2024

Insights from an extensive triaxial testing campaign on a shale for comparative site characterization of a deep geological repository

Lyesse Laloui, Alessio Ferrari, Eleonora Crisci

Several boreholes were drilled for site comparison of a deep geological repository (DGR) in Northern Switzerland. The main target of the exploration program was the >100m thick Opalinus Clay, the designated host rock encountered at approximately 450 to 100 ...

Elsevier2024

Numerical investigation of two-dimensional Mode-II delamination in composite laminates

Thomas Keller, Anastasios Vassilopoulos, Congzhe Wang

Existing standards for delamination tests on composite materials typically employ one-dimensional (1D) beam specimens. However, such specimens may not represent real delamination scenarios in composite structures, where cracks tend to propagate in two dime ...

Elsevier Sci Ltd2024

Water weakening and the compressive brittle strength of carbonates: Influence of fracture toughness and static friction

Marie Estelle Solange Violay, Barnaby Padraig Fryer, Corentin Jean-Marie Rémi Noël

Water is ubiquitous within the pore space of rocks and has been shown to affect their physical and mechanical behaviour. Indeed, water can act on the rock strength via mechanical (i.e., reducing the effective stresses) or chemical effects (e.g., mineral di ...

2024

An adaptive phase field approach to 3D internal crack growth in rocks

Tao Xu, Michael Heap, Alexandra Roma Larisa Kushnir

Modeling the 3D internal crack under compression entails complex fracture mechanics (mode I-II-III fracture), resulting in substantial computational costs and challenges in characterizing fracture morphology characterization for Phase Field Method (PFM) si ...

2024

Strain engineering and strain measurement by spring tethers on suspended epitaxial GaN-on-Si photonic crystal devices

Romuald Houdré, Jun Wang

Suspended epitaxial gallium nitride (GaN) on silicon (Si) photonic crystal devices suffer from large residual tensile strain, especially for long waveguides, because fine structures tend to crack due to large stress. By introducing spring-like tethers, des ...

Iop Publishing Ltd2024

Strain relaxation and multidentate anchoring in n-type perovskite transistors and logic circuits

Mohammad Khaja Nazeeruddin, Olga Syzgantseva

The engineering of tin halide perovskites has led to the development of p-type transistors with field-effect mobilities of over 70 cm2 V-1 s-1. However, due to their background hole doping, these perovskites are not suitable for n-type transistors. Ambipol ...

Nature Portfolio2024

Graph generative deep learning models with an application to circuit topologies

Igor Krawczuk

Modern integrated circuits are tiny yet incredibly complex technological artifacts, composed of millions and billions of individual structures working in unison. Managing their complexity and facilitating their design drove part of the co-evolution of mode ...

EPFL2024

A modular multiple frequency inductive link to wirelessly power multiple miniaturized implants

Sandro Carrara, Diego Ghezzi, Gian Luca Barbruni

A modular multiple frequency coils inductive link system to wirelessly provide power for at least a medical implant at an output of a receiving coil, whereby the receiving coil is configured to be implanted in an organism. The modular multiple frequency co ...

2024

Enabling simultaneous reprocessability and fire protection via incorporation of phosphine oxide monomer in epoxy vitrimer

Véronique Michaud, Valentin Rougier

The conception of epoxy thermosets with both reprocessability and flame retardancy delineates a new horizon in polymer science, offering a material solution that is not only superior in fire safety but is also environment friendly. Herein, a flame-retardan ...

Journal Mater Sci Technol2024

Moulding and Microfluidic Wet Spinning of the Soft Polymer Optical Fibers for Sensory Applications

Khushdeep Sharma

Polymer optical fibre (POFs) based wearable sensors have attracted a lot of attention in the field of healthcare and biomedical applications. They are in particular envision as the next generation of sensors for the continuous, real-time n ...

EPFL2024

Customized modular multi-material mouthguard and method of making the same

Dominique Pioletti, Martin Broome, Naser Nasrollahzadeh Mamaghani

There is described a mouthguard comprising an externally exposed impact protective region defined by a first material property and configured to cover a front tooth, an internally exposed occlusional cushioning region defined by a second material property ...

2024

Pyroresistive response of percolating conductive polymer composites

Claudio Grimaldi

The pyroresistive response of conductive polymer composites (CPCs) has attracted much interest because of its potential applications in many electronic devices requiring a significant responsiveness to changes in external physical parameters such as temper ...

Amer Physical Soc2024