Publication

Thermal-Aware Design of of 3D ICs with Inter-Tier Liquid Cooling

David Atienza Alonso
2010
Conference Papers

Résumé

Advances in manufacturing technologies are enabling the development of 3D multi-processor ICs, but heat in 3D stacking can lead to degraded performance due to higher power density, which derives from the placement of computational units and storage components on top of each other. Since it is more difficult to remove the heat from 3D ICs, cooling can become the main limiting factor for future 3D multiprocessor system-on-chip (MPSoCs). This paper presents a novel thermal-aware design paradigm for 3D ICs, which includes thermal modeling as a fundamental step to design 3D with inter-tier liquid cooling as well as system-level dynamic thermal management to tune the coolant flow rate to achieve energy-efficient thermally-balanced 3D MPSoCs

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https://infoscience.epfl.ch/entities/publication/8b7a586e-bda3-46b3-b7a2-e4cb15ef2199

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David Atienza Alonso
2010
Conference Papers

Résumé

Source officielle

https://infoscience.epfl.ch/entities/publication/8b7a586e-bda3-46b3-b7a2-e4cb15ef2199

À propos de ce résultat

Concepts associés (21)

Three-dimensional integrated circuit

A three-dimensional integrated circuit (3D IC) is a MOS (metal-oxide semiconductor) integrated circuit (IC) manufactured by stacking as many as 16 or more ICs and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections, so that they behave as a single device to achieve performance improvements at reduced power and smaller footprint than conventional two dimensional processes. The 3D IC is one of several 3D integration schemes that exploit the z-direction to achieve electrical performance benefits in microelectronics and nanoelectronics.

Multi-chip module

A multi-chip module (MCM) is generically an electronic assembly (such as a package with a number of conductor terminals or "pins") where multiple integrated circuits (ICs or "chips"), semiconductor dies and/or other discrete components are integrated, usually onto a unifying substrate, so that in use it can be treated as if it were a larger IC. Other terms for MCM packaging include "heterogeneous integration" or "hybrid integrated circuit".

Circuit intégré

Le circuit intégré (CI), aussi appelé puce électronique, est un composant électronique, basé sur un semi-conducteur, reproduisant une ou plusieurs fonctions électroniques plus ou moins complexes, intégrant souvent plusieurs types de composants électroniques de base dans un volume réduit (sur une petite plaque), rendant le circuit facile à mettre en œuvre. Il existe une très grande variété de ces composants divisés en deux grandes catégories : analogique et numérique.

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