Hybrid Two-Phase Cooling Technology For Next-Generation Servers: Thermal Performance Analysis

This paper advances the work presented at ITHERM 2020 where a novel passive two-phase technology was introduced for more efficient cooling of datacenters compared to air-based cooling solutions (e.g. In-Room, In-Row, etc.). The proposed hybrid two-phase cooling technology uses passive low-height thermosyphons to dissipate the heat generated by high power components inside the servers. The heat is then transferred to multiple rack-level thermosyphons, equipped with one or more overhead compact condensers, which in turn dissipate the total heat from the rack into a room-level water-based or air-based cooling loop. Air-cooling is still used for the low heat-generating components (e.g. memory units, secondary chips, etc.) to make the cooling technology cost effective.