Publication

Friction based locomotion module for mobile MEMS robots

Reymond Clavel, Jean-Marc Breguet, Amar Rida, Walter Driesen
2007
Conference Papers

Résumé

The “Modulated Friction Inertial Drive (MFID) principle” is presented as a locomotion solution for mmsize micro robots dealing with both size constraints and limitations in terms of power consumption. Based on one of the configurations of this locomotion principle a locomotion module (10 × 10 mm2) with two degrees of freedom (X,ThetaZ) has been developed. It consists of two horizontally vibrating masses actuated by electrostatic comb drives and fabricated by DRIE on a SOI wafer. The design as well as calculated and measured actuator displacements and resonance frequencies are presented. First locomotion experiments have shown a linear velocity of 0.207 mm/s for a driving voltage of 30 Vp2p and a power consumption of only 16.6 μW.

Source officielle

https://infoscience.epfl.ch/entities/publication/a4e46b2b-d05d-4c88-ac9a-bb67603e1eae

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Reymond Clavel, Jean-Marc Breguet, Amar Rida, Walter Driesen
2007
Conference Papers

Résumé

Source officielle

https://infoscience.epfl.ch/entities/publication/a4e46b2b-d05d-4c88-ac9a-bb67603e1eae

À propos de ce résultat

Concepts associés (18)

Fish locomotion

Fish locomotion is the various types of animal locomotion used by fish, principally by swimming. This is achieved in different groups of fish by a variety of mechanisms of propulsion, most often by wave-like lateral flexions of the fish's body and tail in the water, and in various specialised fish by motions of the fins.

Die shrink

En microélectronique, un die shrink est la réduction de la taille d'une puce électronique qui peut s'effectuer selon plusieurs manières : par changement de technique de gravure : un produit peut être converti par les équipes de développement, par exemple passer de de taille de transistor à : cela aura pour effet de fortement diminuer les dimensions de la puce. par une réduction optique de l'impression de la puce sur silicium.

Three-dimensional integrated circuit

A three-dimensional integrated circuit (3D IC) is a MOS (metal-oxide semiconductor) integrated circuit (IC) manufactured by stacking as many as 16 or more ICs and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections, so that they behave as a single device to achieve performance improvements at reduced power and smaller footprint than conventional two dimensional processes. The 3D IC is one of several 3D integration schemes that exploit the z-direction to achieve electrical performance benefits in microelectronics and nanoelectronics.

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