Publications related to Clock skew

A 500 x 500 Dual-Gate SPAD Imager With 100% Temporal Aperture and 1 ns Minimum Gate Length for FLIM and Phasor Imaging Applications

Edoardo Charbon, Claudio Bruschini, Andrei Ardelean, Paul Mos, Arin Can Ülkü, Michael Alan Wayne

In this article, we report on SwissSPAD3 (SS3), a 500 x 500 pixel single-photon avalanche diode (SPAD) array, fabricated in 0.18-mu m CMOS technology. In this sensor, we introduce a novel dual-gate architecture with two contiguous temporal windows, or gate ...

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC2022

DASS: Combining Dynamic & Static Scheduling in High-Level Synthesis

Paolo Ienne, Lana Josipovic

A central task in high-level synthesis is scheduling: the allocation of operations to clock cycles. The classic approach to scheduling is static, in which each operation is mapped to a clock cycle at compile-time, but recent years have seen the emergence o ...

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC2022

Low Noise Clock Generation: Modeling, Analysis and Implementation

Duygu Kostak

The aim of this thesis is to implement, analyze and improve the selected low noise clock generation and distribution techniques for ADC implementations. The thesis is divided into two parts. The first part focuses on the sampling phase generation and distr ...

EPFL2021

Combining Dynamic & Static Scheduling in High-level Synthesis

Paolo Ienne, Lana Josipovic

A central task in high-level synthesis is scheduling: the allocation of operations to clock cycles. The classic approach to scheduling is static, in which each operation is mapped to a clock cycle at compile-time, but recent years have seen the emergence o ...

ASSOC COMPUTING MACHINERY2020

Low-Power Design of Digital VLSI Circuits around the Point of First Failure

Andrea Bonetti

As an increase of intelligent and self-powered devices is forecasted for our future everyday life, the implementation of energy-autonomous devices that can wirelessly communicate data from sensors is crucial. Even though techniques such as voltage scaling ...

EPFL2019

Fabrication and Characterisation of Epitaxial PMN-PT Nano-structures

Xiao Di

Downscaling of the minimal feature size, or the gate length has been the key for the exponential im-provement of the performance of the logic CMOS integrated circuits over the last six decades. How-ever, since about 2003, some fundamental limits in the dev ...

EPFL2019

Inverse Gating for Low Energy Block Ciphers

Francesco Regazzoni, Subhadeep Banik

In this paper we explore the technique of “inverse gating” which is a significant improvement over the ”round gating” technique introduced in HOST 2016. Round gating worked by generating timing signals to separate glitch propagation from one circuit elemen ...

2018

End-to-End Industrial Study of Retiming

Giovanni De Micheli, Cunxi Yu, Maciej Jerzy Ciesielski

Sequential circuits are combinational circuits that are separated by registers. Retiming is considered as the most promising technique for optimizing sequential circuits, that involves moving the edge-triggered registers across the combinational logic with ...

IEEE2018

Trading off Energy versus Accuracy in Modern Computing Systems : From Digital Circuit Design to Programming Techniques

Jérémy Lucien Maurice Schlachter

The slowdown of Moore's law, which has been the driving force of the electronics industry over the last 5 decades, is causing serious problem to Integrated Circuits (ICs) improvements. Technology scaling is becoming more and more complex and fabrication co ...

EPFL2018

Automated Integration of Dual-Edge Clocking for Low-Power Operation in Nanometer Nodes

Andreas Peter Burg, Adam Shmuel Teman, Andrea Bonetti, Nicholas Alexander Preyss

Clocking power, including both clock distribution and registers, has long been one of the primary factors in the total power consumption of many digital systems. One straightforward approach to reduce this power consumption is to apply dual-edge-triggered ...

Association for Computing Machinery2017

Design and Analysis of Jitter-Aware Low-Power and High-Speed TSV Links for 3D ICs

Giovanni De Micheli, Yusuf Leblebici, Alessandro Cevrero, Kiarash Gharibdoust, Giulia Beanato

This paper presents a circuit-level design and analysis of high-data-rate 3D serial vertical links which exploit the high bandwidth provided by TSV technology. As most of the existing TSVs consume a large amount of die area, the serial configuration can sa ...

Elsevier2016

Exploiting Dynamic Timing Margins in Microprocessors for Frequency-Over-Scaling with Instruction-Based Clock Adjustment

Andreas Peter Burg, Georgios Karakonstantis, Jeremy Hugues-Felix Constantin, Anupam Chattopadhyay

Static timing analysis provides the basis for setting the clock period of a microprocessor core, based on its worst-case critical path. However, depending on the design, this critical path is not always excited and therefore dynamic timing margins exist th ...

2015

Signaling in 3-D integrated circuits, benefits and challenges

Somayyeh Rahimian Omam

Three-dimensional (3-D) or vertical integration is a design and packaging paradigm that can mitigate many of the increasing challenges related to the design of modern integrated systems. 3-D circuits have recently been at the spotlight, since these circuit ...

EPFL2015

GentleRain: Cheap and Scalable Causal Consistency with Physical Clocks

Willy Zwaenepoel, Calin Iorgulescu, Jiaqing Du, Amitabha Roy

GentleRain is a new causally consistent geo-replicated data store that provides throughput comparable to eventual consistency and superior to current implementations of causal consistency. GentleRain uses a periodic aggregation protocol to deter- mine whet ...

ACM2014

A 65k pixel, 150k frames-per-second camera with global gating and micro-lenses suitable for fluorescence lifetime imaging

Edoardo Charbon, Claudio Bruschini, Samuel Burri, Francesco Regazzoni, François Eric Powolny

This paper presents our work on a 65k pixel single-photon avalanche diode (SPAD) based imaging sensor realized in a 0.35 mu m standard CMOS process. At a resolution of 512 by 128 pixels the sensor is read out in 6.4ps to deliver over 150k monochrome frames ...

Spie-Int Soc Optical Engineering2014

Timing Uncertainty in 3-D Clock Trees due to Process Variations and Power Supply Noise

Giovanni De Micheli, Xifan Tang, Vasileios Pavlidis, Hu Xu, Wayne Burleson

Clock distribution networks are affected by different sources of variations. The resulting clock uncertainty significantly affects the frequency of a circuit. To support this analysis, a statistical model of skitter, which consists of clock skew and jitter ...

Institute of Electrical and Electronics Engineers2013

An Enhanced Design Methodology for Resonant Clock Trees

Giovanni De Micheli, Xifan Tang, Vasileios Pavlidis, Somayyeh Rahimian Omam

Clock distribution networks consume a considerable portion of the power dissipated by synchronous circuits. In conventional clock distribution networks, clock buffers are inserted to retain signal integrity along the long interconnects, which, in turn, sig ...

American Scientific Publishers2013

A Geiger Mode APD fabricated in Standard 65nm CMOS Technology

Edoardo Charbon, Hyungjune Yoon

We present the first avalanche photodiode (APD) successfully fabricated in standard 65nm CMOS technology. The APD operates both in proportional and Geiger mode at -60C to +60C temperature range. The device comprises an octagonal n+p-well junction surrounde ...

2013

The Combined Effect of Process Variations and Power Supply Noise on Clock Skew and Jitter

Giovanni De Micheli, Vasileios Pavlidis, Hu Xu, Wayne Burleson

In modern VLSI circuits, a large number of clock buffers are inserted in clock distribution networks, which are significantly affected by process and power supply noise variations. The combined effect of process variations and power supply noise on clock s ...

Ieee2012

Effects of Process Variations on 3-D Global Clock Distribution Networks

Giovanni De Micheli, Hu Xu, Vasileios Pavlidis

In three-dimensional (3D) integrated circuits, the effect of process variations on clock skew differs from 2D circuits. The combined effect of inter-die and intra-die process variations on the design of 3D clock distribution networks is considered in this ...

Assoc Computing Machinery2012