Concept

Multi-chip module

Related lectures (28)

Explores the landscape of big data, memory importance in online services, challenges faced by memory systems, emerging DRAM technologies, and storage-class memory.

Packaging of Intelligent Systems

Covers the packaging of intelligent systems, solder systems, major chip interconnection types, and packaging trends.

Interconnects: Networks-on-Chip

Covers cache partitioning, Vantage scheme, interconnects, and Networks-on-Chip in many-core systems.

3D Integration: Evolution and Applications

Explores the evolution and applications of 3D integration, highlighting its benefits and challenges, as well as its potential impact on sensor systems and societal advancements.

Rigorous System Design

Explores the challenges of designing reactive systems, emphasizing correctness and productivity in system design.

Server Processors: Efficiency and Design Optimization

Explores server processor inefficiencies, hardware integration trends, and design optimization criteria for efficient servers.

Chip Packaging Process Flow: Major Steps

Covers the major steps in chip packaging and the evolution of packaging technologies.

Designing Cyber-Physical Systems

Explores the design of cyber-physical systems, emphasizing technology, sensors, applications, and on-chip communication networks.

Transactional Memory: Two-phase Locking and Invisible Reads

Explores historical perspectives and mechanisms of transactional memory, emphasizing the importance and challenges of its implementation in modern computing systems.

Packaging of Intelligent Systems

Explores constraints in packaging systems, hierarchical assembly, chip packaging process, solder importance, and Pb-free solders.

X-ray Techniques and Applications

Explores synchrotrons, x-ray techniques, ptychography, and nondestructive chip architecture study using PyXL.

BIP Framework: System Design and Priorities

Explores the BIP framework, emphasizing system design flow and the role of priorities in reducing non-determinism and expressing scheduling policies.

Hardware Specialization

Explores hardware specialization, ASIC advantages over processors, and strategies for achieving ASIC-like efficiencies in chip design.

Infrared Photodetectors: Mercury Cadmium Telluride Technology

Covers the technology and applications of Mercury Cadmium Telluride photoconductors in infrared detection systems.

Scheduling Internals: Metrics and Policies

Discusses scheduling internals, metrics, and policies in computer systems, emphasizing efficiency and the complexities of modern multi-core architectures.

Ultra-Low Power Computing Toolbox

Introduces the IcySoC project, focusing on ultra-low power computing and approximate computing techniques for energy efficiency and performance optimization.

Reactive NUCA: Cache Block Placement & Replication

Explores cache block placement, replication policies, and management strategies in Reactive NUCA for multi-core caches.

Introduction to VLSI: a quick tour

Offers a historical journey through VLSI technology, covering key milestones, challenges, and future prospects in the field.

Advanced MEMS Packaging

Explores advanced MEMS packaging techniques, including flip-chip technology and wafer-level bonding for stress control and hermetic sealing.

Three-Dimensional Computer Chips

Explores the creation of three-dimensional computer chips, focusing on performance, energy consumption, and wiring solutions.