Publications related to Solder paste

Through-Glass Vias for Glass Interposers and MEMS Packaging Applications Fabricated Using Magnetic Assembly of Microscale Metal Wires

A through-glass via (TGV) provides a vertical electrical connection through a glass substrate. TGVs are used in advanced packaging solutions, such as glass interposers and wafer-level packaging of microelectromechanical systems (MEMS). However, TGVs are ch ...

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC2018

Optimisation of industrial production of low-force sensors – adhesive bonding of force-centring ball

Peter Ryser, Thomas Maeder, Caroline Jacq, Maxime Blot

This work addresses the issue of attaching the force-centring part (a round ball) to the load cell of a force sensor, a piezoresistive thick-film Wheatstone bridge deposited onto a ceramic cantilever. As the current soldering process requires expensive met ...

IOP2015

Deformation and Damage in Lead-free Solder Joints : Microstructure-based Modeling and Experimental Characterization

Milad Maleki

For environmental reasons, lead has been banned from microelectronic solder materials since the adoption of the RoHS legislation in 2006. A large number of investigations have lead to the development of new lead-free solder materials like the SnAgCu alloy ...

EPFL2012

Fabrication of Polymer-Based Micro Devices: Formulation and Study of the Paste

Peter Ryser, Thomas Maeder, Nathalie Sophie Adeline Serra, Olivier Gentsch

We investigate in the present work the fabrication of polymer-based micro-fluidic and micro-mechanical devices using sacrificial, resistive/conductive pastes, through a screen-printing process. An organic sacrificial paste is first screen-printed onto a su ...

Elsevier2011

Correlation of microstructural and mechanical properties in particle reinforced lead-free solders

Venkatesh Sivasubramaniam

Solders are widely used as interconnect material for the electronic industry. The solder interconnect provides both electrical contact and mechanical connection between the integrated circuit devices and their substrate. Thus solders with good reliability ...

EPFL2009

Reliability Analysis of Lead-free Solders

John Botsis, Joël Cugnoni

In this study, a deep analysis of the reliability of lead-free (SnAgCu) solders in comparison with tin-lead solders have been done for a particular aerospace application. Creep properties of this solder composition have been investigated, and results have ...

Int Assoc Engineers-Iaeng, Unit1, 1-F, 37-39 Hung To Road, Kwun Tong, Hong Kong, 00000, Peoples R China2008

Experimental and numerical studies on size and constraining effects in lead-free solder joints

John Botsis, Joël Cugnoni, Venkatesh Sivasubramaniam

Search String Advanced > Saved Searches > ARTICLE TOOLS Get PDF (641K) Save to My Profile E-mail Link to this Article Export Citation for this Article Get Citation Alerts Request Permissions More Sharing ServicesShare | Share on citeuli ...

2007

Towards Reliable 100-Nanometer Scale Stencil Lithography on Full Wafer: Progress AND Challenges

Jürgen Brugger, Marc Antonius Friedrich van den Boogaart, Oscar Vazquez Mena

We have fabricated new and robust nanostencil membranes for the surface patterning of 100-nm scale Al wires on full wafer scale. The stencil membranes are mechanically reinforced with corrugations, making them more stable against accumulated stress. The ap ...

IEEE2007

Fabrication of low temperature co-fired ceramic (LTCC)-based sensor and micro-fluidic structures

Hansu Birol

Low temperature co-fired ceramic (LTCC) technology has attracted remarkable attention in fabrication of sensors and micro-fluidic devices in the last decade. Although structuring planar LTCC foils, which are processed and screen-printed with thick-films, s ...

EPFL2007

Superparamagnetic iron oxide nanoparticle coupled tissue soldering

Heinrich Hofmann, Alke Fink, Benedikt Steitz

The invention relates to superparamagnetic iron oxide nanoparticles for use in sutureless thermal mediated tissue fusion. The nanoparticles are dispersed in a biocompatible solder material and heated by application of an alternating electromagnetic field. ...

2007

Laser Sealed Packaging for Microsystems

Jacques Jacot, Frank Seigneur

Packaging is the last process of microsystem manufacturing. There are mainly two kinds of packages: plastic or metallic. The two main components of the package (base and cover) may either be glued or soldered. Each of these techniques has its advantages an ...

2006

Laser Soldered Packaging Hermeticity Measurement Using Metallic Conductor Resistance

Jacques Jacot, Thomas Maeder, Frank Seigneur

Packaging is the last step of the manufacturing process of Microsystems. The LPM is working on the development of a two-part soldered packaging. One part of the package is metallic; the other part is made of glass. The goal of the project is to solder the ...

2006

Laser soldered packaging hermeticity measurement using metallic conductor resistance

Jacques Jacot, Thomas Maeder, Frank Seigneur

Packaging is the last step of the manufacturing process of Microsystems. The LPM is working on the development of a two-part soldered packaging. One part of the package is metallic; the other part is made of glass. The goal of the project is to solder the ...

2006