Concept

Integrated circuit packaging

Related lectures (18)

Chip Packaging Process Flow: Major Steps

Covers the major steps in chip packaging and the evolution of packaging technologies.

Covers the packaging of intelligent systems, solder systems, major chip interconnection types, and packaging trends.

Explores advanced MEMS packaging techniques, including flip-chip technology and wafer-level bonding for stress control and hermetic sealing.

MEMS Packaging: 3D Integration & Advanced Technologies

Explores advanced MEMS packaging technologies, including 3D integration, hermetic packaging, and wafer-level packaging processes.

VLSI Testing: Techniques and Economics

Explores test techniques for digital VLSI systems, covering fault modeling, test-pattern generation, and design for testability.

Packaging of Intelligent Systems

Explores constraints in packaging systems, hierarchical assembly, chip packaging process, solder importance, and Pb-free solders.

Semiconductor Nanowire Biosensors

Explores the use of semiconductor nanowires as biosensors for label-free detection of charged analytes, emphasizing high sensitivity and the need for further research.

Digital Integrated Circuits: Evolution and Design

Covers the evolution of digital integrated circuits, market demands impact, modern IC functionalities, microprocessors history, and Moore's law.

Molecular Transistors: Design and Simulation

Explores molecular transistors for logic computation, design, simulation, and fabrication, emphasizing interconnect parasitics and device performance.

Molecular Transistor Simulation

Explores molecular transistor simulation, covering clock effects, charge distribution, cascading arrays, and circuit fabrication.

Future of ICT

Explores Professor Sakurai's vision for the future of ICT, emphasizing energy efficiency, biocompatibility electronics, and the intersection of technology with societal challenges and business opportunities.

MEMS Resonators and Oscillators

Explores MEMS resonators and oscillators, CMOS integration, frequency stability, temperature drift compensation, resonator packaging, and advanced resonator structures.

Test of VLSI Systems

Covers test techniques for digital VLSI systems, including fault modeling and design for testability.

Package enac-monitoring: build, test, and install

Covers the steps to prepare a new package named enac-monitoring, including building, testing, and installing it.

Microcontrollers: Basics and Applications

Covers the basics of microcontrollers, different packaging types, circuit implementation methods, and software tools for circuit design.

Designing Information Systems: Lessons from CompuSys

Explores challenges in designing effective information systems using the case study of CompuSys.

Memory Cache: Storage and Network

Explores cache memory, data organization impact, storage structuring, communication protocols, and packet switching in computer networks.

Dry Etching of Organic and Metal Films

Explores anisotropic etching of organic films and Al alloys, emphasizing the role of Al2O3 in Al etching and presenting examples of dry etching processes.