Publications by Cyrille Hibert

All-stencil transistor fabrication on 3D silicon substrates

Philippe Langlet, Cyrille Hibert, Peter Vettiger, Jürgen Brugger, Oscar Vazquez Mena, Katrin Sidler Arnet, Andreea Veronica Savu, Luis Guillermo Villanueva Torrijo, Cristina Martin Olmos

The standard lithographic techniques to fabricate electronic components involve the use of polymers, baking steps and chemicals. This typically restricts their application to flat substrates made up of standard materials. Stencil lithography has been propo ...

Iop Publishing Ltd2012

Two-Dimensional MEMS Stage Integrated With Microlens Arrays for Laser Beam Steering

Cyrille Hibert, Sertan Kutal Gökce, Sven Holmström, David Bowman

A novel microelectromechanical stage with one uniaxial set of combs capable of 2-D actuation is presented. A polymer microlens array (MLA) is mounted vertically onto the stage. Driven at resonance, the stage deflects 124 mu m out of plane and 34 mu m in pl ...

Institute of Electrical and Electronics Engineers2011

High aspect ratio sub-micron trenches on silicon-on-insulator and bulk silicon

Mihai Adrian Ionescu, Daniel Grogg, Cyrille Hibert, Marion Hermersdorf

This paper reports on the fabrication of sub-micron trenches on silicon-on-insulator (SOI) required in many MEMS devices and on bulk silicon. Trenches in the range of 100-500 nm had been etched with the deep reactive ion etching (DRIE) by using the SHARP ( ...

2011

Direct Etching of High Aspect structures through a Stencil

Cyrille Hibert, Jürgen Brugger, Oscar Vazquez Mena, Luis Guillermo Villanueva Torrijo

2009

Fluorine based plasma treatment of biocompatible silicone elastomer. Effect of temperature on etch rate and surface properties

Arnaud Bertsch, Cyrille Hibert

This paper describes F-based dry etching and resulting surface properties of biocompatible silicone elastomer. The etch rate of polysiloxane and surface morphology was found to be highly temperature dependent. An increase in temperature results in a signif ...

2008

Combining micelle self-assembly with nanostencil lithography to create periodic/aperiodic micro- /nanopatterns on surfaces

Cyrille Hibert, Jürgen Brugger, Marc Antonius Friedrich van den Boogaart, Sivashankar Krishnamoorthy

Wiley2008

Tunable, high aspect ratio pillars on diverse substrates using copolymer micelle lithography: an interesting platform for applications

Cyrille Hibert, Jürgen Brugger, Sivashankar Krishnamoorthy

We demonstrate the use of copolymer micelle lithography using polystyrene-block-poly(2-vinylpyridine) reverse micelle thin films in their as-coated form to create nanopillars with tunable dimensions and spacing, on different substrates such as silicon, sil ...

2008

High Quality Factor Copper Inductors Integrated in Deep Dry Etched Quartz Substrates

Didier Bouvet, Mihai Adrian Ionescu, Cyrille Hibert, Christine Leroy

2007

Fabrication of Silicon-On-Insulator MEM Resonators with Deep Sub-Micron Transduction Gaps

Mihai Adrian Ionescu, Cyrille Hibert, Marco Mazza, Nicoleta-Diana Ciressan

2007

Fabrication of vertical digital silicon optical micromirrors on suspended electrode for guided-wave optical switching applications

Philippe Renaud, Philippe Flückiger, Cyrille Hibert, Roland Guerre

This paper presents a novel technological and design study of optical guided- wave MicroElectroMechanical Systems (MEMS) switch. We work on a concept of hermetic assembly in which a MEMS wafer is covered (top-down) by a crossing optical waveguide wafer. Th ...

2005

High Performance Copper / Polyimide Inductors Fabricated Using Thick Double Metal Layer Damascene Process

Didier Bouvet, Catherine Dehollain, Mihai Adrian Ionescu, Cyrille Hibert

2005

RF MEMS switches for mobile communications : from metal-metal to suspended-gate MOS device architectures

Raphaël Fritschi, Vincent Pott, Philippe Flückiger, Mihai Adrian Ionescu, Cyrille Hibert, Nicolas Abelé

2005

Fabrication and electrical characterization of high performance copper/polyimide inductors

Didier Bouvet, Catherine Dehollain, Mihai Adrian Ionescu, Cyrille Hibert

This paper presents fabrication and RF characterization results of spiral inductors fabricated using a developed damascene-like thick-copper / polyimide process module. This module has low thermal budget and is compatible with current IC interconnect archi ...

2005

Profile angle control in SIO2 deep anisotropic dry etching for MEMS fabrication

Philippe Renaud, Philippe Flückiger, Cyrille Hibert

We report a recent breakthrough to control profile angle for SiO2 Deep Anisotropic Dry Etching (SDADE). Our study reveals that gas residence time is the key parameter to control profile angle. Moreover, we show that it is possible to control profile angle, ...

2004

Fabrication process and model for a MEMS parallel-plate capacitor above CPW line

Anja Skrivervik, Jean-François Zürcher, Raphaël Fritschi, Philippe Flückiger, Julien Perruisseau-Carrier, Mihai Adrian Ionescu, Cyrille Hibert, Pedro Crespo Valero

2004

High tuning range AlSi RF MEMS capacitors fabricated with sacrificial amorphous silicon surface micromachining

Michel Declercq, Philippe Renaud, Catherine Dehollain, Raphaël Fritschi, Philippe Flückiger, Mihai Adrian Ionescu, Cyrille Hibert, Florin Udrea, Dimitrios Tsamados

This paper reports the fabrication and electrical characterization of high tuning range AlSi RF MEMS capacitors. We present experimental results obtained by a surface micromachining process that uses dry etching of sacrificial amorphous silicon to release ...

2004

3-D integrable optoelectronic devices for telecommunications ICs

Michel Declercq, Philippe Robert, Luc Thévenaz, Philippe Renaud, Philippe Flückiger, Mihai Adrian Ionescu, Georges-André Racine, Cyrille Hibert

The design, fabrication and characterization of CMOS-compatible optoelectronic devices is discussed. All devices are fabricated on silicon on insulator (SOI) substrates which makes them suitable for three-dimensional (3-D) telecommunication photonic integr ...

2002

A novel CMOS SOI unbalanced Mach-Zehnder interferometer: from design and simulations to fabrication and characterization

Michel Declercq, Philippe Robert, Luc Thévenaz, Philippe Renaud, Philippe Flückiger, Mihai Adrian Ionescu, Georges-André Racine, Cyrille Hibert

This paper reports on a novel, simple yet reliable, unbalanced SOI Mach-Zehnder (M-Z) interferometer architecture based on 1.2 μm CMOS process and adapted post-processing for the waveguide sidewalls. The fabricated electro-optical device is based on multip ...

2001