Publications by Arvind Raj Mahankali Sridhar

PowerCool: Simulation of Cooling and Powering of 3D MPSoCs with Integrated Flow Cell Arrays

David Atienza Alonso, Mohamed Mostafa Sabry Aly, Arvind Raj Mahankali Sridhar, Bruno Michel, Artem Andreev, Marina Zapater Sancho

Integrated Flow-Cell Arrays (FCAs) represent a combination of integrated liquid cooling and on-chip power generation, converting chemical energy of the flowing electrolyte solutions to electrical energy. The FCA technology provides a promising way to addre ...

Institute of Electrical and Electronics Engineers2017

ICCAD 2015 Contest in 3D Interlayer Cooling Optimized Network

David Atienza Alonso, Arvind Raj Mahankali Sridhar

Microchannel liquid cooling has been proposed since the late 2000s as a viable enabler for 3D integration of microprocessors to continue scaling of computing power in the face of increasingly reduced returns from CMOS technology scaling. Thermal and electr ...

ACM/IEEE Press2015

Integrated Microfluidic Power Generation and Cooling for Bright Silicon MPSoCs

David Atienza Alonso, Mohamed Mostafa Sabry Aly, Arvind Raj Mahankali Sridhar, Bruno Michel

The soaring demand for computing power in our digital information age has produced as collateral undesirable effect a surge in power consumption and heat density for computing servers. Accordingly, 30-40% of the energy consumed in state-of-the-art servers ...

IEEE/ACM Press2014

PowerCool: Simulation of Integrated Microfluidic Power Generation in Bright Silicon MPSoCs

David Atienza Alonso, Arvind Raj Mahankali Sridhar, Bruno Michel

Integrated microfluidic power generation and power delivery promises to be a disruptive packaging technology with the potential to combat dark silicon. It essentially consists of integrated microchannel-based electrochemical “flow cells” in a 2D/3D multipr ...

IEEE/ACM Press2014

A Semi-Analytical Thermal Modeling Framework for Liquid-Cooled ICs

David Atienza Alonso, Mohamed Mostafa Sabry Aly, Arvind Raj Mahankali Sridhar

While possessing the potential to replace conventional air-cooled heat sinks, inter-tier microchannel liquid cooling of 3D ICs also creates the problem of increased thermal gradients from the fluid inlet to outlet ports [1, 2]. These cooling-induced therma ...

Institute of Electrical and Electronics Engineers2014

A semi-analytical approach for optimized design of microchannel liquid-cooled ICs

David Atienza Alonso, Arvind Raj Mahankali Sridhar

The development of embedded and interlayer liquid cooling in integrated circuits (ICs) using silicon microchannels has gained interest in the recent years owing to the rise of on-chip heat uses that aggravate thermal reliability issues of the emerging 3D s ...

IEEE Press2014

3D-ICE: a Compact Thermal Model for Early-Stage Design of Liquid-Cooled ICs

David Atienza Alonso, Arvind Raj Mahankali Sridhar, Alessandro Vincenzi

Liquid-cooling using microchannel heat sinks etched on silicon dies is seen as a promising solution to the rising heat fluxes in two-dimensional and stacked three-dimensional integrated circuits. Development of such devices requires accurate and fast therm ...

Institute of Electrical and Electronics Engineers2014

GreenCool: An Energy-Efficient Liquid Cooling Design Technique for 3-D MPSoCs Via Channel Width Modulation

David Atienza Alonso, Ayse Kivilcim Coskun, Arvind Raj Mahankali Sridhar, Jie Meng

Liquid cooling using interlayer microchannels has appeared as a viable and scalable packaging technology for 3-D multiprocessor system-on-chips (MPSoCs). Microchannel-based liquid cooling, however, can substantially increase the on-chip thermal gradients, ...

Institute of Electrical and Electronics Engineers2013

STEAM: a fast compact thermal model for two-phase cooling of integrated circuits

John Richard Thome, Yassir Madhour, David Atienza Alonso, Arvind Raj Mahankali Sridhar

Two-phase liquid cooling of computer chips via microchannels etched directly on silicon dies is a potential long-term solution to enable continued integration of high-performance multiprocessors. Two-phase cooling refers to the heat removal via evaporation ...

IEEE/ACM Press2013

Thermal Simulation of Liquid-Cooled Integrated Circuits

Arvind Raj Mahankali Sridhar

Growing demands for increased functionality in consumer electronics and for information technology-enabled services in various sectors have resulted in the rise of high-performance multiprocessor system-on-chips (MPSoCs) and three-dimensionally stacked int ...

EPFL2013

Neural Network-Based Thermal Simulation of Integrated Circuits on GPUs

David Atienza Alonso, Arvind Raj Mahankali Sridhar, Martino Ruggiero, Alessandro Vincenzi

With the rising challenges in heat removal in integrated circuits (ICs), the development of thermal-aware computing architectures and run-time management systems have become indispensable to the continuation of IC design scaling. These thermal-aware design ...

Institute of Electrical and Electronics Engineers2012

Thermal Balancing of Liquid-Cooled 3D-MPSoCs Using Channel Modulation

David Atienza Alonso, Arvind Raj Mahankali Sridhar

While possessing the potential to replace conventional air-cooled heat sinks, inter-tier microchannel liquid cooling of 3D ICs also creates the problem of increased thermal gradients from the fluid inlet to outlet ports [1, 2]. These cooling-induced therma ...

ACM and IEEE Press2012

Accelerating Thermal Simulations of 3D ICs with Liquid Cooling using Neural Networks

David Atienza Alonso, Arvind Raj Mahankali Sridhar, Martino Ruggiero, Alessandro Vincenzi

Vertical integration is a promising solution to further increase the performance of future ICs, but such 3D ICs present complex thermal issues that cannot be solved by conventional cooling techniques. Interlayer liquid cooling has been proposed to extract ...

ACM2012

Fast Thermal Simulation of 2D/3D Integrated Circuits Exploiting Neural Networks and GPUs

David Atienza Alonso, Arvind Raj Mahankali Sridhar, Martino Ruggiero, Alessandro Vincenzi

Heat removal is one of the major challenges faced in developing the new generation of high density integrated circuits. Future design technologies strongly depend on the availability of efficient means for thermal modeling and analysis. These thermal model ...

ACM and IEEE Press2011

Compact transient thermal model for 3D ICs with liquid cooling via enhanced heat transfer cavity geometries

David Atienza Alonso, Arvind Raj Mahankali Sridhar, Martino Ruggiero, Alessandro Vincenzi

The advent of 3D stacked ICs with accumulating heat fluxes stresses thermal reliability and is responsible for temperature driven performance deterioration of the electronic systems Hot spots with power densities typically rising up to 250 W/cm2 are not ac ...

IEEE Press2010

3D-ICE: Fast compact transient thermal modeling for 3D-ICs with inter-tier liquid cooling

David Atienza Alonso, Arvind Raj Mahankali Sridhar, Martino Ruggiero, Alessandro Vincenzi

Three dimensional stacked integrated circuits (3D ICs) are extremely attractive for overcoming the barriers in interconnect scaling, offering an opportunity to continue the CMOS performance trends for the next decade. However, from a thermal perspective, v ...

ACM and IEEE Press2010

Thermal modeling and analysis of 3D multi-processor chips

Arvind Raj Mahankali Sridhar

As 3D chip multi-processors (3D-CMPs) become the main trend in processor development, various thermal management strategies have been recently proposed to optimize system performance while controlling the temperature of the system to stay below a threshold ...

Elsevier2010

Through Silicon Via-Based Grid for Thermal Control in 3D Chips

Yusuf Leblebici, David Atienza Alonso, Vinod Pangracious, José Luis Ayala Rodrigo, Arvind Raj Mahankali Sridhar

3D stacked chips have become a promising integration technology for modern systems. The complexity reached in multi-processor systems has increased the communication delays between processing cores, and an effective way to diminish this impact on communica ...

Springer2009