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Publications associées (26)

A Multiport Isolated DC-DC Converter

Drazen Dujic, Yan-Kim Tran

This paper presents a multi-port isolated DC-DC converter for DC applications. A three-port structure is presented, characterized with full bidirectional power flow and simple control. Galvanic isolation is achieved by means of a multi-winding medium frequ ...

IEEE2016

FaCSI: A block parallel preconditioner for fluid-structure interaction in hemodynamics

Alfio Quarteroni, Simone Deparis, Davide Forti, Gwenol Grandperrin

Modeling Fluid-Structure Interaction (FSI) in the vascular system is mandatory to reliably compute mechanical indicators in vessels undergoing large deformations. In order to cope with the computational complexity of the coupled 3D FSI problem after discre ...

Academic Press Inc Elsevier Science2016

Real-Time Omnidirectional Imaging System with Interconnected Network of Cameras

Alexandre Schmid, Yusuf Leblebici, Vladan Popovic, Hossein Afshari, Kerem Seyid

The Panoptic camera is an omnidirectional multi-aperture visual system which is realized by mounting multiple imaging sensors on a hemispherical frame. In this chapter, we will present a novel distributed and parallel implementation of the real-time omnidi ...

Springer-Verlag2015

A Real-time Multi-aperture Omnidirectional Visual Sensor Based on Interconnected Network of Smart Cameras

Alexandre Schmid, Yusuf Leblebici, Vladan Popovic, Hossein Afshari, Abdulkadir Akin, Kerem Seyid, Ömer Cogal

Centralized and multi-level implementations of the Panoptic omnidirectional multiaperture visual system were previously presented by the authors, relying on transmission of all camera outputs to a single central processing node for omnidirectional image an ...

Institute of Electrical and Electronics Engineers2015

Near Optimal Work-Stealing Tree Scheduler for Highly Irregular Data-Parallel Workloads

Martin Odersky, Aleksandar Prokopec

We present a work-stealing algorithm for runtime scheduling of data-parallel operations in the context of shared-memory architectures on data sets with highly-irregular workloads that are not known a priori to the scheduler. This scheduler can parallelize ...

Springer-Verlag Berlin2014

Low Power 3D Serial TSV Link for High Bandwidth Cross-Chip Communication

Giovanni De Micheli, Yusuf Leblebici, Alessandro Cevrero, Giulia Beanato

3D-ICs based on TSV technology provide high bandwidth inter-chip connections. The drawback is that most of the existing TSVs consume a large amount of silicon real estate. We present circuit-level design and analysis of area efficient, low power, high-data ...

2014

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