Publications associées à Package testing

Rapidly verifiable aggregate signatures

Rachid Guerraoui, Gauthier Jérôme Timothée Voron, Martina Camaioni, Matteo Monti, Manuel José Ribeiro Vidigueira, Pierre-Louis Blaise Roman

A method for aggregating digital signatures comprises the following steps carried out by a signature aggregator: receiving first data packages from signers, each first data package comprising a signer identifier, a payload, and a payload signature; verifyi ...

2024

Dataset for "Complexity of crack front geometry enhances toughness of brittle solids"

John Martin Kolinski, Chenzhuo Li, Xinyue Wei

This data package supports the publication 'Complexity of crack front geometry enhances toughness of brittle solids' by Xinyue Wei, Chenzhuo Li, Cían McCarthy, and John M. Kolinski Nature physics (2024) - https://doi.org/10.1038/s41567-024-02435-x DOI: 1 ...

Zenodo2024

Dataset for the paper High durability and stability of 2D nanofluidic devices for long-term single-molecule sensing

Aleksandra Radenovic, Andras Kis, Martina Lihter, Mukesh Kumar Tripathi, Mukeshchand Thakur, Andrey Chernev, Nianduo Cai, Yunfei Teng, Michal Daniel Macha, Yanfei Zhao, Miao Zhang

Information regarding the Dataset, corresponding to the paper: “Thakur, M., Cai, N., Zhang, M. et al. High durability and stability of 2D nanofluidic devices for long-term single-molecule sensing. npj 2D Mater Appl 7, 11 (2023). https://doi.org/10.1038/s41 ...

Zenodo2023

Tunable biocomposite films fabricated using cellulose nanocrystals and additives for food packaging

Wenjing Sun, Cong Chen

Cellulose nanocrystals (CNCs) are considered a prospective packaging material to partially replace petroleumbased plastics attributed to their renewability, sustainability, biodegradability, and desirable attributes including transparency, oxygen, and oil ...

ELSEVIER SCI LTD2023

REMOTE: Re-thinking Task Mapping on Wireless 2.5D Systems-on-Package for Hotspot Removal

David Atienza Alonso, Marina Zapater Sancho, Giovanni Ansaloni, Darong Huang, Rafael Medina Morillas

2.5D Systems-on-Package (SoPs) are composed by several chiplets placed on an interposer. They are becoming increasingly popular as they enable easy integration of electronic components in the same package and high fabrication yields. Nevertheless, they int ...

2023

Lignin, from biomass waste to sustainable materials for food packaging, antiviral coatings and agriculture

Alice Boarino

Our planet has been challenged for years by our reckless use of fossil fuels, which has led to the ongoing climate change and energy crisis. The transition to the use of renewable alternative sources has now became urgent and inevitable. The valorization o ...

EPFL2023

Enablers for Overcurrent Capability of Silicon-Carbide-Based Power Converters: An Overview

Elison de Nazareth Matioli

With the increase in penetration of power electronic converters in the power systems, a demand for overcurrent/ overloading capability has risen for the fault clearance duration. This article gives an overview of the limiting factors and the recent technol ...

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC2023

The Scikit HEP Project - overview and prospects

Matthieu Philippe Luther Marinangeli, Pratyush Das

Scikit-HEP is a community-driven and community-oriented project with the goal of providing an ecosystem for particle physics data analysis in Python. Scikit-HEP is a toolset of approximately twenty packages and a few "a ffiliated" packages. It expands the ...

E D P SCIENCES2020

Reversible Oxygen Sensing Based on Multi-Emission Fluorescence Quenching

Esther Amstad, René M. Rossi, Efe Armagan, Claudio Toncelli, Akin Gürsoy

Oxygen is ubiquitous in nature and it plays a key role in several biological processes, such as cellular respiration and food deterioration, to name a few. Currently, reversible and non-destructive oxygen sensing is usually performed with sensors produced ...

2020

ROS-Neuro: A common middleware for BMI and robotics. The acquisition and recorder packages

José del Rocio Millán Ruiz, Luca Tonin, Stefano Tortora

Recent advances in the Brain-Machine Interface (BMI) and in the robotic fields allowed researchers to design a new generation of brain-actuated neuroprostheses to control a variety of assistive devices-ranging from powered wheelchairs to telepresence robot ...

IEEE2019

Solid-liquid interdiffusion (SLID) bonding in the Au-In system: experimental study and 1D modelling

Michel Rappaz, Aïcha Hessler-Wyser, Léa Deillon, Thierry Hessler

Au-In bonds with a nominal composition of about 60 at.% In were fabricated for use in wafer-level packaging of MEMS. The microstructure of the bonds was studied by scanning electron microscopy. The bond hermeticity was then assessed using oxidation of Cu t ...

Institute of Physics2015

Non-contact sub-nanometer optical repositioning using femtosecond lasers

Yves Bellouard

Optical components like resonator or waveguides often have stringent requirements in term of positioning accuracy during packaging. While this can be done routinely in a laboratory environment, permanently positioning and aligning optical elements with nan ...

Optical Society of America2015

A Power Pack Based on Organometallic Perovskite Solar Cell and Supercapacitor

Michael Graetzel, Shaik Mohammed Zakeeruddin, Mingkui Wang, Hua Zhang

We present an investigation on a power pack combining a CH3NH3PbI3-based solar cell with a polypyrrole-based supercapacitor and evaluate its performance as an energy pack. The package achieved an energy storage efficiency of 10%, which is much higher than ...

American Chemical Society2015

High-temperature compatible 3D-integration processes for a vacuum-sealed CNT-based NEMS

Nico de Rooij, Danick Briand, Terunobu Akiyama, Rokhaya Gueye

A System-in-Package (SiP) concept for the 3D-integration of a Single Wall Carbon Nanotube (SWCNT) resonator with its CMOS driving electronics is presented. The key element of this advanced SiP is the monolithic 3D-integration of the MEMS with the CMOS elec ...

SPIE - International Society of Optical Engineering2013

Integrated packaging solutions and hotplates for a miniature atomic clock and other microsystems

Fabrizio Vecchio

This thesis aimed at developing innovative packaging solutions for a miniature atomic clock and other microsystems in the cm-scale, i.e. somewhat larger than what is practical for full "chip-scale" device-package integration using clean-room technologies f ...

EPFL2013

Thermal Simulation of Liquid-Cooled Integrated Circuits

Arvind Raj Mahankali Sridhar

Growing demands for increased functionality in consumer electronics and for information technology-enabled services in various sectors have resulted in the rise of high-performance multiprocessor system-on-chips (MPSoCs) and three-dimensionally stacked int ...

EPFL2013

An analysis of destination choice for opaque airline products using multidimensional binary logit models

Michel Bierlaire, Alexandre Khelifa

We investigate how customers respond to an opaque airline product offered by a European carrier. In this opaque product design, customers are randomly assigned to travel to one of approximately ten destinations; however, for a fee they may exclude one or m ...

Pergamon-Elsevier Science Ltd2012

Implantable Antennas for Biomedical Applications

Francesco Merli

Since the introduction of implantable pacemakers in the early 1960s, implantable medical devices have become more and more interesting for healthcare services. Nowadays, the devices designed to monitor physiological data from inside the human body have gre ...

EPFL2011

Electrical modeling and design of a wafer-level package for MEM resonators

Mihai Adrian Ionescu, Anja Skrivervik, Julien Perruisseau-Carrier, Marco Mazza

This paper presents the electrical design and characterization of a wafer-level, or 0-level, package for micro-electromechanical resonators. We start by identifying the requirements on the electrical parasitics of a packaged resonator, derived from an anal ...

Institute of Electrical and Electronics Engineers2010

Physical Design Issues in 3-D Integrated Technologies

Vasileios Pavlidis

Design techniques for three-dimensional (3-D) ICs considerably lag the significant strides achieved in 3-D manufacturing technologies. Advanced design methodologies for 2-D circuits are not sufficient to manage the added complexity caused by the third dime ...

Springer-Verlag New York, Ms Ingrid Cunningham, 175 Fifth Ave, New York, Ny 10010 Usa2010