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Publications associées (30)

Method for flattening substrates or layers using 3d printing and etching

Niels Quack, Teodoro Graziosi, Marcell Kristof Kiss, Nathanaël Restori

The present invention concerns a layer or substrate flattening method comprising the steps of: - providing a layer or substrate (1) to be flattened; - measuring a topography or surface profile of at least one area (3) of the layer or substrate to be flatte ...

2021

Shear and Breathing Modes of Layered Materials

Nicola Marzari, Giovanni Pizzi, Marco Gibertini

Layered materials (LMs), such as graphite, hexagonal boron nitride, and transition-metal dichalcogenides, are at the center of an ever-increasing research effort, due to their scientific and technological relevance. Raman and infrared spectroscopies are ac ...

AMER CHEMICAL SOC2021

Experimental assessment of traffic density estimation at link and network level with sparse data

Nikolaos Geroliminis, Anna Takayasu

This paper investigates the accuracy of mean density estimation from direct sensing at link and network levels. Different calculation methods are compared depending on sensor type, probe vehicles or loop detectors, and availability to quantify the magnitud ...

TAYLOR & FRANCIS LTD2022

Stretchable tubular device and use thereof as a counterpulsation device

Yves Perriard, Yoan René Cyrille Civet, Thomas Guillaume Martinez, Jonathan André Jean-Marie Chavanne, Morgan Almanza

The present invention is related to a stretchable tubular device (1) comprising at least one layer (Lx) of a stretchable polymer, a power supply (2) and a set of electrodes (3a, 3b) connected to said power supply (2). The power supply can supply at least a ...

2021

Nanoscale Study of the Hole-Selective Passivating Contacts with High Thermal Budget Using C-AFM Tomography

Christophe Ballif, Franz-Josef Haug, Quentin Thomas Jeangros, Gizem Nogay, Philipp Friedrich Hermann Löper, Martin Ledinsky

We investigate hole-selective passivating contacts that consist of an interfacial layer of silicon oxide (SiOx) and a layer of boron-doped SiCx(p). The fabrication process of these contacts involves an annealing step at temperatures above 750 degrees C whi ...

AMER CHEMICAL SOC2021

Annealing and Replica-Symmetry in Deep Boltzmann Machines

Emanuele Mingione, Diego Alberici

In this paper we study the properties of the quenched pressure of a multi-layer spin-glass model (a deep Boltzmann Machine in artificial intelligence jargon) whose pairwise interactions are allowed between spins lying in adjacent layers and not inside the ...

SPRINGER2020

Exploiting Errors for Efficiency: A Survey from Circuits to Applications

Babak Falsafi, Alexandros Daglis, Eva Darulova, Mattia Cacciotti, Damien Zufferey, Dorde Jevdic, Sasa Misailovic

When a computational task tolerates a relaxation of its specification or when an algorithm tolerates the effects of noise in its execution, hardware, system software, and programming language compilers or their runtime systems can trade deviations from cor ...

ASSOC COMPUTING MACHINERY2020

Physical Layer Aspects of LoRa and Full-Duplex Wireless Transceivers

Orion Afisiadis

Wireless communications are currently faced with two main challenges. The first challenge stems from the enormous number of Internet of Things (IoT) devices that transmit very small amounts of data. The second challenge is the need for ever-increasing data ...

EPFL2020

Private and Secure Distributed Learning

Georgios Damaskinos

The ever-growing number of edge devices (e.g., smartphones) and the exploding volume of sensitive data they produce, call for distributed machine learning techniques that are privacy-preserving. Given the increasing computing capabilities of modern edge de ...

EPFL2020

Stretchable Kirigami Components for Composite Meso-Scale Robots

Jamie Paik, Amir Firouzeh, Tatsuya Higashisaka

Layer-by-layer manufacturing of composite mechanisms allows fast and cost-effective fabrication of customized robots in millimeter and centimeter scales which is promising for research fields that rely on frequent and numerous physical iterations. Due to t ...

2020

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