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Publications associées (26)

Design Optimization of 3D Multi-Processor System-on-Chip with Integrated Flow Cell Arrays

David Atienza Alonso, Marina Zapater Sancho, Ayse Kivilcim Coskun, Artem Andreev, Fulya Kaplan

Integrated flow cell array (FCA) is an emerging technology, targeting the cooling and power delivery challenges of modern 2D/3D Multi-Processor Systems-on-Chip (MPSoCs). In FCA, electrolytic solutions are pumped through microchannels etched in the silicon ...

2018

Experimental characterisation of the thermohydraulic performance of a micro-pin fin evaporator: Heat transfer, flow visualization and modelling

Chiara Falsetti

The global tendency towards miniaturization driven by the microelectronics industry is pushing system density and packaging towards unprecedented values of thermal design power, with a dramatic reduction of the surface area of the devices. Vertical integra ...

EPFL2018

Copper TSV-Based Process Development for Die-Level Homogeneous and Heterogeneous 3D Integration Platform

Seniz Esra Küçük

Research and development efforts on chip and wafer-scale 3D integration for system miniaturization have been continuing for more than a decade. However, there are still only a handful of 3D integrated products available in the market due to the high cost a ...

EPFL2017

Array imaging system for lithography

Toralf Scharf, Wilfried Noell, Raoul Kirner

We present an integrated array imaging system based on a stack of microlens arrays. The microlens arrays are manufactured by melting resist and reactive ion etching (RIE) technology on 8'' wafers (fused silica) and mounted by wafer-level packaging (WLP)(1) ...

Spie-Int Soc Optical Engineering2016

A Chip-Level Post-CMOS Via-Last Cu TSV Process for Multi-Layer Homogeneous 3D Integration

Seniz Esra Küçük, Yusuf Leblebici, Woo Yeong Cho

In this paper, a die-level CMOS post-processing scheme for 3D integration using the via-last approach is presented for multi-layer stacking. The process includes TSV fabrication, chip-to-chip bonding, and finally the TSV filling with Cu electroplating. The ...

Ieee2016

Energy correlations of photon pairs generated by a silicon microring resonator probed by Stimulated Four Wave Mixing

Matteo Galli, Christophe Marcel Georges Galland, Davide Grassani

Compact silicon integrated devices, such as micro-ring resonators, have recently been demonstrated as efficient sources of quantum correlated photon pairs. The mass production of integrated devices demands the implementation of fast and reliable techniques ...

Nature Research2016

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