Publications de Bruno Michel | EPFL Graph Search

PowerCool: Simulation of Cooling and Powering of 3D MPSoCs with Integrated Flow Cell Arrays

David Atienza Alonso, Mohamed Mostafa Sabry Aly, Arvind Raj Mahankali Sridhar, Bruno Michel, Artem Andreev, Marina Zapater Sancho

Integrated Flow-Cell Arrays (FCAs) represent a combination of integrated liquid cooling and on-chip power generation, converting chemical energy of the flowing electrolyte solutions to electrical energy. The FCA technology provides a promising way to addre ...

Institute of Electrical and Electronics Engineers2017

Thermo-Economic Analysis of a Trigeneration HCPVT Power Plant

François Maréchal, Bruno Michel, Angelos Selviaridis, Anna Sophia Wallerand

The increasing need for electricity and heat in a growing global economy must be combined with CO2 emissions reduction, in order to limit the human influence on the environment. This calls for energy-efficient and cost- competitive renewable energy systems ...

2015

Integrated Microfluidic Power Generation and Cooling for Bright Silicon MPSoCs

David Atienza Alonso, Mohamed Mostafa Sabry Aly, Arvind Raj Mahankali Sridhar, Bruno Michel

The soaring demand for computing power in our digital information age has produced as collateral undesirable effect a surge in power consumption and heat density for computing servers. Accordingly, 30-40% of the energy consumed in state-of-the-art servers ...

IEEE/ACM Press2014

Modeling of Two-Phase Evaporative Heat Transfer in Three-Dimensional Multicavity High Performance Microprocessor Chip Stacks

John Richard Thome, Yassir Madhour, Jackson Braz Marcinichen, Bruno Michel, Brian Paul D'Entremont

Three-dimensional (3D) stacking of integrated-circuit (IC) dies increases system density and package functionality by vertically integrating two or more dies with area-array through-silicon-vias (TSVs). This reduces the length of global interconnects and t ...

American Society of Mechanical Engineers2014

Dynamic flow control and performance comparison of different concepts of two-phase on-chip cooling cycles

John Richard Thome, Jackson Braz Marcinichen, Duan Wu, Bruno Michel

A hybrid on-chip two-phase cooling cycle specifically designed to cool server boards with chips of high performance computers was experimentally evaluated considering steady-state and transient operation of two parallel pseudo-chips and auxiliary electroni ...

Elsevier2014

PowerCool: Simulation of Integrated Microfluidic Power Generation in Bright Silicon MPSoCs

David Atienza Alonso, Arvind Raj Mahankali Sridhar, Bruno Michel

Integrated microfluidic power generation and power delivery promises to be a disruptive packaging technology with the potential to combat dark silicon. It essentially consists of integrated microchannel-based electrochemical “flow cells” in a 2D/3D multipr ...

IEEE/ACM Press2014

Integration of Intra Chip Stack Fluidic Cooling using Thin-Layer Solder Bonding

John Richard Thome, Yusuf Leblebici, Yassir Madhour, Michail Zervas, Bruno Michel

Three-dimensional (3D) stacking of integrated circuit (IC) dies by vertical integration increases system density and package functionality. The vertical integration of IC dies by area-array Through-Silicon-Vias (TSVs) reduces the length of global interconn ...

IEEE2013

Flow Boiling of R134a in a Multi-Microchannel Heat Sink with Hotspot Heaters for Energy-Efficient Microelectronic CPU Cooling Applications

John Richard Thome, Yassir Madhour, Etienne Costa-Patry, Jonathan Olivier, Bruno Michel

This paper focuses on two-phase flow boiling of refrigerant R134a inside a copper multi-microchannel heat sink for microelectronic central processing unit cooling applications. The heat sink is composed of 100 parallel microchannels, 100 mu m wide, 680 mu ...

2011

Two-phase flow of refrigerants in 85μm-wide multi-microchannels: Part II – Heat transfer with 35 local heaters

John Richard Thome, Etienne Costa-Patry, Jonathan Olivier, Bruno Michel

This article is the second part of a study on flow boiling of R236fa and R245fa. This part presents the heat transfer coefficients obtained in a 12.7 mm silicon evaporator composed of 135 microchannels with 85 mu m wide and 560 mu m high channels separated ...

Elsevier2011

Energy-Efficient Variable-Flow Liquid Cooling in 3D Stacked Architectures

David Atienza Alonso, Ayse Kivilcim Coskun, Bruno Michel

Liquid cooling has emerged as a promising solution for addressing the elevated temperatures in 3D stacked architectures. In this work, we first propose a framework for detailed thermal modeling of the microchannels embedded between the tiers of the 3D syst ...

ACM/IEEE Press2010

Cooling of microprocessors with micro-evaporation: A novel two-phase cooling cycle

John Richard Thome, Jackson Braz Marcinichen, Bruno Michel

Three micro-evaporator cooling cycles, one with a pump, one with a compressor and a hybrid of the two together, are proposed for cooling a computer blade server. The hybrid cycle is characterized by the interchangeability between the first two cycles, wher ...

Elsevier2010

Effect of Inlet Orifice on Saturated CHF and Flow Visualization in Multi-microchannel Heat Sinks

John Richard Thome, Jung Eung Park, Bruno Michel

This article investigates the effect of inlet orifices on saturated critical heat flux (CHF) in multi-microchannel heat sinks. Two different multi-microchannel heat sinks made in copper were tested with three low pressure refrigerants (R134a, R236fa, R245f ...

Ieee Service Center, 445 Hoes Lane, Po Box 1331, Piscataway, Nj 08855-1331 Usa2009

High Heat Flux Flow Boiling in Silicon Multi-Microchannels: Part I – Heat Transfer Characteristics of R-236fa

John Richard Thome, Bruno Agostini, Bruno Michel

Elsevier2008

High Heat Flux Flow Boiling in Silicon Multi-Microchannels: Part II – Heat Transfer Characteristics of R-245fa

John Richard Thome, Bruno Agostini, Bruno Michel

Elsevier2008

High Heat Flux Flow Boiling in Silicon Multi-Microchannels: Part III – Saturated Critical Heat Flux of R236fa and Two-Phase Pressure Drop

John Richard Thome, Rémi Revellin, Bruno Agostini, Bruno Michel

Elsevier2008

High Heat Flux Two-Phase Cooling in Silicon Multi-Microchannels

John Richard Thome, Bruno Agostini, Bruno Michel

Institute of Electrical and Electronics Engineers2008

State of the Art of High Heat Flux Cooling Technologies

John Richard Thome, Jung Eung Park, Leszek Wojtan, Bruno Agostini, Bruno Michel

The purpose of this literature review is to compare different cooling technologies currently in development in research laboratories that are competing to solve the challenge of cooling the next generation of high heat flux computer chips. Today, most deve ...

2007