Publications associées à System-Level Exploration of In-Package Wireless Communication for Multi-Chiplet Platforms

Accelerator-driven Data Arrangement to Minimize Transformers Run-time on Multi-core Architectures

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The increasing complexity of transformer models in artificial intelligence expands their computational costs, memory usage, and energy consumption. Hardware acceleration tackles the ensuing challenges by designing processors and accelerators tailored for t ...

2024

Integrated Wireless Power, Data Communication, and Thermal Sensing System for Autonomous Multisite Brain Implants

Implanted medical devices (IMDs) have been widely developed to support the monitoring and recording of biological data inside the body or brain. Wirelessly powered IMDs, a subset of implantable electronics, have been proposed to eliminate the limitations r ...

EPFL2024

REMOTE: Re-thinking Task Mapping on Wireless 2.5D Systems-on-Package for Hotspot Removal

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2.5D Systems-on-Package (SoPs) are composed by several chiplets placed on an interposer. They are becoming increasingly popular as they enable easy integration of electronic components in the same package and high fabrication yields. Nevertheless, they int ...

2023

Sub-kHz-Linewidth External-Cavity Laser (ECL) With Si3N4 Resonator Used as a Tunable Pump for a Kerr Frequency Comb

Tobias Kippenberg, Junqiu Liu

Combining optical gain in direct-bandgap III-V materials with tunable optical feedback offered by advanced photonic integrated circuits is key to chip-scale external-cavity lasers (ECL), offering wideband tunability along with low optical linewidths. Exter ...

IEEE Institute of Electrical and Electronics Engineers2023

Integrated electronics for time-of-flight positron emission tomography photodetectors

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Positron emission tomography is a nuclear imaging technique well known for its use in oncology for cancer diagnosis and staging. A PET scanner is a complex machine which comprises photodetectors placed in a ring configuration that detect gamma photons gen ...

EPFL2023

Computational Imaging SPAD Cameras

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Vision systems built around conventional image sensors have to read, encode and transmit large quantities of pixel information, a majority of which is redundant. As a result, new computational imaging sensor architectures were developed to preprocess the r ...

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Deep Learning for Localized-Haptic Feedback in Tactile Surfaces

Camilo Hernandez Mejia

Touchscreens are nowadays the preferred choice for user interfaces in consumer electronics. Significant technological advances have been made in terms of touch sensing and visual quality. However, the haptic feedback offered by commercial products is still ...

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Building Chips Faster: Hardware-Compiler Co-Design for Accelerated RTL Simulation

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The demise of Moore's Law and Dennard scaling has resulted in diminishing performance gains for general-purpose processors, and so has prompted a surge in academic and commercial interest for hardware accelerators. Specialized hardware has already redefine ...

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Robust Training and Verification of Deep Neural Networks

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According to the proposed Artificial Intelligence Act by the European Comission (expected to pass at the end of 2023), the class of High-Risk AI Systems (Title III) comprises several important applications of Deep Learning like autonomous driving vehicles ...

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Full System Exploration of On-Chip Wireless Communication on Many-Core Architectures

David Atienza Alonso, Giovanni Ansaloni, Marina Zapater Sancho, Yasir Mahmood Qureshi, Joshua Alexander Harrison Klein, Rafael Medina Morillas

In order to develop sustainable and more powerful information technology (IT) infrastructures, the challenges posed by the "memory wall" are critical for the design of high-performance and high-efficiency many-core computing systems. In this context, recen ...

IEEE2022

Development of a large-area, light-weight module using the MALTA monolithic pixel detector

Edoardo Charbon, Ashish Sharma, Francesco Piro

The MALTA pixel chip is a 2 cm x 2 cm large monolithic pixel detector developed in the Tower 180 nm imaging process. The chip contains four CMOS transceiver blocks at its sides which allow chip-to-chip data transfer. The power pads are located mainly at th ...

ELSEVIER2022

Thermal and Voltage-Aware Performance Management of 3D MPSoCs with Flow Cell Arrays and Integrated SC Converters

David Atienza Alonso, Halima Najibi, Giovanni Ansaloni, Marina Zapater Sancho, Alexandre Sébastien Julien Levisse

Flow cell arrays (FCAs) concurrently provide efficient on-chip liquid cooling and electrochemical power generation. This technology is especially promising for three-dimensional multi-processor systems-on-chip (3D MPSoCs) realized in deeply scaled technolo ...

2022

FPGA-to-CPU Undervolting Attacks

Mirjana Stojilovic, Dina Gamaleldin Ahmed Shawky Mahmoud

FPGAs are proving useful and attractive for many applications, thanks to their hardware reconfigurability, low power, and high-degree of parallelism. As a result, modern embedded systems are often based on systems-on-chip (SoCs), where CPUs and FPGAs share ...

IEEE2022

Medipix4, a high granularity four sides buttable pixel readout chip for high resolution spectroscopic X-ray imaging at rates compatible with medical CT scans

Viros Sriskaran

Medipix4 is the latest member in the Medipix/Timepix family of pixel detector chips aimed at high rate spectroscopic X-ray imaging using high-Z materials. The chip address the limitations of conventional hybrid pixel detectors for X-ray imaging. Its predec ...

EPFL2022

Thermal and Power-Aware Run-Time Performance Management of 3D MPSoCs with Integrated Flow Cell Arrays

David Atienza Alonso, Halima Najibi, Giovanni Ansaloni, Marina Zapater Sancho, Alexandre Sébastien Julien Levisse

Flow Cell Arrays (FCA) technology employs microchannels filled with an electrolytic fluid to concurrently provide cooling and power generation to integrated circuits (ICs). This solution is particularly appealing for Three-Dimensional Multi-Processor Syste ...

2022

A Capacitively-Coupled Chopper Instrumentation Amplifier for Implantable Bridge Sensor Systems

Marco Mattavelli, Catherine Dehollain, Diego Ruben Barrettino, Kerim Türe, Mustafa Besirli

This paper presents an energy and area efficient capacitively-coupled chopper instrumentation amplifier (CCIA) dedicated to implantable bridge sensor systems. Chopper stabilization is employed to decrease its offset and 1/f noise and the resulting ripple d ...

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Robustness and invariance properties of image classifiers

Apostolos Modas

Deep neural networks have achieved impressive results in many image classification tasks. However, since their performance is usually measured in controlled settings, it is important to ensure that their decisions remain correct when deployed in noisy envi ...

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Understanding Deep Neural Function Approximation in Reinforcement Learning via ϵ-Greedy Exploration

Volkan Cevher, Luca Viano, Fanghui Liu

This paper provides a theoretical study of deep neural function approximation in reinforcement learning (RL) with the ϵ-greedy exploration under the online setting. This problem setting is motivated by the successful deep Q-networks (DQN) framework that fa ...

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Theory of Deep Learning: Neural Tangent Kernel and Beyond

Arthur Ulysse Jacot-Guillarmod

In the recent years, Deep Neural Networks (DNNs) have managed to succeed at tasks that previously appeared impossible, such as human-level object recognition, text synthesis, translation, playing games and many more. In spite of these major achievements, o ...

EPFL2022

Integration of MEMS in Silicon Photonics

Alain Yuji Takabayashi

Like integrated electronics, integrated photonics such as Silicon Photonics benefit from increased device-density on a single chip. Silicon is an excellent material for integrated photonics because its high refractive index allows devices to be made small, ...

EPFL2021