Publications associées à A 3D-Printed Functional Mems Accelerometer

An Ultralow-Power Triaxial MEMS Accelerometer With High-Voltage Biasing and Electrostatic Mismatch Compensation

This article presents a triaxial micro electromechani-cal system (MEMS) capacitive accelerometer using a high-voltage biasing technique to achieve high resolution with ultralow power. The accelerometer system generates a differential pair of high voltages ...

Ieee-Inst Electrical Electronics Engineers Inc2024

Front-End Circuits for Radiation-Hard Monolithic CMOS Sensors targeting High-Energy Physics Applications

Francesco Piro

Monolithic pixel sensors integrate the sensor matrix and readout in the same silicon die, and therefore present several advantages over the more largely used hybrid detectors in high-energy physics. They offer an easier detector assembly, lower cost, lower ...

EPFL2023

Micro 3D printing of a functional MEMS accelerometer

Göran Stemme, Luis Guillermo Villanueva Torrijo, Damien Maillard, Simone Pagliano

Microelectromechanical system (MEMS) devices, such as accelerometers, are widely used across industries, including the automotive, consumer electronics, and medical industries. MEMS are efficiently produced at very high volumes using large-scale semiconduc ...

SPRINGERNATURE2022

A new versatile hybrid MEMS technology for high sensitivity, fluid proof sensing applications

Matthias Neuenschwander

The field of micro electromechanical systems (MEMS) evolved from the microelectronic industry and the technologies developed to fabricate integrated circuits. As a result, MEMS are commonly fabricated on silicon wafers. The development of MEMS has been dri ...

EPFL2022

Stereolithography-Based Antennas for Satellite Communications in Ka-Band

Juan Ramon Mosig, Joana Rita Alves dos Santos Silva, Tomislav Debogovic, Maria Garcia Vigueras

This paper illustrates the role of additive manufacturing (AM) as enabling technology to realize high-performance low-cost antennas for Ka-band applications. In addition to the inherent electromagnetic challenges implicit in the conception of such complex ...

Ieee-Inst Electrical Electronics Engineers Inc2017

Microfluidic Scintillation Detectors for High Energy Physics

Pietro Maoddi

This thesis deals with the development and study of microfluidic scintillation detectors, a technology of recent introduction for the detection of high energy particles. Most of the interest for such devices comes from the use of a liquid scintillator, whi ...

EPFL2015

In-plane fabrication of insulated gold-tip probes for electrochemical and force spectroscopy molecular experiments

Nico de Rooij, Terunobu Akiyama, Sebastian Gautsch, Peter Van der Wal, Yexian Wu

A new and versatile fabrication process of insulated gold tip probes for atomic force microscopy (AFM) is presented by Wu et al. (In-plane fabricated insulated gold-tip probe for electrochemical and molecular experiments, in: 2013 IEEE 26th International C ...

Elsevier2014

Encapsulated Low Frequency Vibrating Body Field Effect Resonator

Marion Hermersdorf

Resonators for time and frequency reference applications are essential elements found in most electronic devices surrounding us. The continuous minimization and ubiquitous distribution of such electronic devices and circuits demands for resonators of small ...

EPFL2013

3D structuration of LTCC and related technologies for thermal management and microfluidic structures

Thomas Maeder, Peter Ryser, Caroline Jacq, Bo Jiang, Fabrizio Vecchio, Conor Joseph Slater

Ceramic technologies such as LTCC (Low Temperature Co-fired Ceramic) and thick-film are used widely in electronic circuits exposed to harsh environments, for applications in fields such as aerospace, automotive and energy exploration, where, owing to their ...

Soc Microelectronics, Electron Components Materials-Midem2012

All-stencil transistor fabrication on 3D silicon substrates

Philippe Langlet, Cyrille Hibert, Peter Vettiger, Jürgen Brugger, Oscar Vazquez Mena, Katrin Sidler Arnet, Andreea Veronica Savu, Luis Guillermo Villanueva Torrijo, Cristina Martin Olmos

The standard lithographic techniques to fabricate electronic components involve the use of polymers, baking steps and chemicals. This typically restricts their application to flat substrates made up of standard materials. Stencil lithography has been propo ...

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Capacités variables et inductances MEMS RF pour une intégration "Above-IC"

Alexander Mehdaoui

This work was carried out in a collaborative framework between Ecole Polytechnique Fédérale de Lausanne and an industrial partner ST Microelectronics. RF MEMS passives are key devices for the RF front-end in modern transceiver and receiver architectures, o ...

EPFL2007