Publications associées à Co-fired ceramic

3D Printing of Customizable Transient Bioelectronics and Sensors

Transient electronics have emerged as a new category of devices that can degrade after their functional lifetime, offering tremendous potential as disposable sensors, actuators, wearables, and implants. Additive manufacturing methods represent a promising ...

2024

First developments towards producing inductive magnetic sensors using state-of-the-art photolithography techniques

Duccio Testa, Marcus Cemes, Ambrine Douhane

Inductive magnetic sensors are needed for tokamak operation to provide the low-frequency (LF) measurements leading to the equilibrium reconstruction and to monitor the higher frequency (HF) instabilities; the HF magnetic sensors are often also used as a ba ...

2023

A 3D-Printed Functional Mems Accelerometer

Luis Guillermo Villanueva Torrijo, Damien Maillard, Göran Stemme, Simone Pagliano

3D printing of MEMS devices could enable the cost-efficient production of custom-designed and complex 3D MEMS for prototyping and for low-volume applications. In this work, we present the first micro 3D-printed functional MEMS accelerometers using two-phot ...

IEEE2023

Femtosecond laser-induced modifications and self-organization in complex glass systems

Gözden Torun

Ultrashort laser pulses, i.e., pulses emitted shorter than a picosecond, can tailor material properties by introducing permanent modifications locally in three dimensions. Remarkably, under a certain exposure condition, these modifications are accompanied ...

EPFL2023

Interlocking modular microfluidic cooling substrates for future high energy physics experiments

Massimo Angeletti

In high energy physics, semiconductor-based sensors are widely used in particle tracking applications. These sensors are typically glued on low-mass cooling substrates, which guarantee the correct thermal management and, at the same time, minimise their in ...

EPFL2023

Front-End Circuits for Radiation-Hard Monolithic CMOS Sensors targeting High-Energy Physics Applications

Francesco Piro

Monolithic pixel sensors integrate the sensor matrix and readout in the same silicon die, and therefore present several advantages over the more largely used hybrid detectors in high-energy physics. They offer an easier detector assembly, lower cost, lower ...

EPFL2023

A new versatile hybrid MEMS technology for high sensitivity, fluid proof sensing applications

Matthias Neuenschwander

The field of micro electromechanical systems (MEMS) evolved from the microelectronic industry and the technologies developed to fabricate integrated circuits. As a result, MEMS are commonly fabricated on silicon wafers. The development of MEMS has been dri ...

EPFL2022

Triple Crossed Flexure Pivot Based on a Zero Parasitic Center Shift Kinematic Design

Simon Nessim Henein, Etienne Frédéric Gabriel Thalmann

Thanks to their absence of play, absence of contact friction and possible monolithic fabrication, flexure pivots offer advantages over traditional bearings in small-scale, high accuracy applications and environments where lubrication and wear debris are pr ...

2022

Micro 3D printing of a functional MEMS accelerometer

Luis Guillermo Villanueva Torrijo, Damien Maillard, Göran Stemme, Simone Pagliano

Microelectromechanical system (MEMS) devices, such as accelerometers, are widely used across industries, including the automotive, consumer electronics, and medical industries. MEMS are efficiently produced at very high volumes using large-scale semiconduc ...

SPRINGERNATURE2022

Wafer-Level Vacuum Sealing for Packaging of Silicon Photonic MEMS

Niels Quack, Hamed Sattari, Alain Yuji Takabayashi, Göran Stemme

Silicon (Si) photonic micro-electro-mechanical systems (MEMS), with its low-power phase shifters and tunable couplers, is emerging as a promising technology for large-scale reconfigurable photonics with potential applications for example in photonic accele ...

SPIE-INT SOC OPTICAL ENGINEERING2021

Switchable and Simultaneous Spatiotemporal Analog Computing with Computational Graphene-based Multilayers

Romain Christophe Rémy Fleury, Ali Momeni

In the past few years, analog computing has experienced rapid development but mostly for a single function. Motivated by parallel space-time computing and miniaturization, we show that reconfigurable graphene-based multilayerss offer a promising path towar ...

2022

Polarity-Controllable Devices and Circuits for Doping-Free 2D Electronics

Giovanni Vincenzo Resta

The growth of information technology has been sustained by the miniaturization of Complementary Metal-Oxide-Semiconductor (CMOS) Field-Effect Transistors (FETs), with the number of devices per unit area constantly increasing, as exemplified by Mooreâ s la ...

EPFL2019

Advanced Diamond Microfabrication for Microoptics and Photonics

Marcell Kristof Kiss

Diamond is an exceptional material - hard, stiff, transparent, which makes it ideal for the fabrication of optical and mechanical systems that take advantage of these properties. Diamond is not only "better", but it offers the possibility of integrating br ...

EPFL2019

Monolithic Fabrication of Silicon Nanowires Bridging Thick Silicon Structures

Davide Sacchetto, Yusuf Leblebici, Oliver Peric, Zuhal Tasdemir

A monolithic process is developed for the fabrication of Si nanowires within thick Si substrates. A combination of anisotropic etch and sidewall passivation is utilized to protect and release Si lines during the subsequent deep etch. An etch depth of 10 mu ...

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC2018

Leakage Flux Modeling of Multi-Winding Transformers for System-Level Simulations

Drazen Dujic, Min Luo, Jost Allmeling

In multiwinding transformers, different geometry of the individual windings leads to unbalanced leakage flux paths. The unbalance affects the behavior of the power electronic converters, where these transformers are used. This paper proposes an approach to ...

Ieee-Inst Electrical Electronics Engineers Inc2018

Manipulation of Bloch surface waves: from subwavelength focusing to nondiffracting beam

Hans Peter Herzig, Myun Sik Kim

We present a different type of electromagnetic surface wave than a surface plasmon polariton (SPP), called Bloch surface wave (BSW). BSWs are sustained by dielectric multilayers, and therefore they do not suffer from dissipation. Their propagation length i ...

SPIE Digital Library2018

Stereolithography-Based Antennas for Satellite Communications in Ka-Band

Juan Ramon Mosig, Tomislav Debogovic, Maria Garcia Vigueras, Joana Rita Alves dos Santos Silva

This paper illustrates the role of additive manufacturing (AM) as enabling technology to realize high-performance low-cost antennas for Ka-band applications. In addition to the inherent electromagnetic challenges implicit in the conception of such complex ...

Ieee-Inst Electrical Electronics Engineers Inc2017

Top-Down Technique for Scaling toNnano in Silicon MEMS

Yusuf Leblebici, Zuhal Tasdemir, Mustafa Yilmaz, Yasin Kilinc

Nanoscale building blocks impart added functionalities to microelectromechanical systems (MEMS). The integration of silicon nanowires with MEMS-based sensors leading to miniaturization with improved sensitivity and higher noise immunity is one example high ...

American Vacuum Society2017

Hardware/Software Co-Design of Ultra-Low Power Biomedical Monitors

Ruben Braojos Lopez

Ongoing changes in world demographics and the prevalence of unhealthy lifestyles are imposing a paradigm shift in healthcare delivery. Nowadays, chronic ailments such as cardiovascular diseases, hypertension and diabetes, represent the most common causes o ...

EPFL2016

Chip-Level CMOS Co-Integration of ReRAM-Based Non-Volatile Memories

Elmira Shahrabi, Yusuf Leblebici, Jury Sandrini, Tugba Demirci, Mahmoud Hadad, Behnoush Attarimashalkoubeh

This work reports a technique to fabricate ReRAM crossbar arrays co-integrated with fully finished 180 nm CMOS technology chips. The proposed integration method enables low- cost ReRAM-CMOS integration and allows the rapid prototyping of complete memory sy ...

Ieee2016