Publications associées à Eau-forte

Demonstrating and Unraveling a Controlled Nanometer-Scale Expansion of the Vacancy Defects in Graphene by CO2

Kumar Varoon Agrawal, Kuang-Jung Hsu, Luis Francisco Villalobos Vazquez de la Parra

A controlled manipulation of graphene edges and vacancies is desired for molecular separation, sensing and electronics applications. Unfortunately, available etching methods always lead to vacancy nucleation making it challenging to control etching. Herein ...

Wiley-VCH Verlag GmbH2022

Study on the Performances of AlScN based SAW/BAW Hybrid Resonators A Parametric Analysis of Acoustic Wave Resonators with Large Figure of Merit

Luis Guillermo Villanueva Torrijo, Soumya Yandrapalli, Guilain Lionel Germain Lang

In this study, we analyze a 3rd type of FBAR's fundamental mode by finite element method. We show the importance of the substrate's wave velocity and conductivity on the electromechanical coupling efficiency. Then we demonstrate that etching traditional SA ...

IEEE2021

Microfluidics by Additive Manufacturing for Wearable Biosensors: A Review

Christian Enz, Sandro Carrara, Mahshid Alsadat Padash

Wearable devices are nowadays at the edge-front in both academic research as well as in industry, and several wearable devices have been already introduced in the market. One of the most recent advancements in wearable technologies for biosensing is in the ...

2020

Ultrahigh flux gas-selective nanoporous carbon membrane and manufacturing method thereof

Kumar Varoon Agrawal, Nikunj Dudani, Mostapha Dakhchoune, Shiqi Huang, Guangwei He

The present relates to a nanoporous carbon membrane manufacturing method comprising coating a block copolymer film with hydrophilic and hydrophobic blocks, on a sacrificial non-porous substrate so as to prepare an block copolymer film coated foil, transfer ...

2018

High-aspect ratio nanopatterning via combined thermal scanning probe lithography and dry etching

Jürgen Brugger, Yuliya Lisunova

Thermal scanning probe lithography is an emerging nanofabrication technique for rapid prototyping of arbitrary topographies in thermally sensitive resist. This feature, paired to the recent advances in dry plasma etching techniques, allows the fabrication ...

Elsevier2017

Graphene : from Growth to Devices

Laurent Syavoch Bernard

We report a full study of graphene synthesis by CVD on Cu surface. Two CVD methods have been developed. The first is a static one, which yields monolayer of graphene at low pressure of methane in 3 minutes at 1000 C. The second one is an equimolar method w ...

EPFL2015

Water adsorption on etched hydrophobic surfaces of L-, D- and DL-valine crystals

Juan José Segura Sugranes

The adsorption of water on etched (001) surfaces of L-, D- and DL-valine crystals has been characterized by atomic force microscopy (AFM) using different operational modes (contact, non-contact and electrostatic) above and below the dew point, the temperat ...

Elsevier2014

Top-Down Fabrication of Silicon Nanowires in Ultra-deep Trenches

Georg Fantner, Davide Sacchetto, Yusuf Leblebici, Oliver Peric, Zuhal Tasdemir

One-Dimensional (1D) nanostructures have gained a considerable attention in the field of semiconductor technology for the past several decades. With the help of rapid development in the process technology, it becomes possible to scale these nanostructures ...

2014

High Piezoelectric Longitudinal Coefficients in Sol-gel PZT Thin Film Multilayers

Paul Muralt, Andrea Mazzalai, Antonia Neels, Silviu Cosmin Sandu, Nachiappan Chidambaram, Alex Dommann, Davide Balma

A five-layer stack of lead zirconate titanate (PZT) thin films with Pt electrodes was fabricated for potential applications in nanoactuator systems. The 1 mu m thick PZT films were deposited by a sol-gel technique, the platinum electrodes by sputtering. Th ...

Wiley-Blackwell2014

Application of stencil masks for ion beam lithographic patterning

Jürgen Brugger, Andreea Veronica Savu

The application of Au/Si3N4 stencil masks for the transfer of patterns using different MeV-ion beams with various substrates has been investigated. The techniques investigated were namely, conventional lithography with positive- and negative-tone resist po ...

Elsevier2013

Robust PECVD SiC membrane made for stencil lithography

Jürgen Brugger, Andreea Veronica Savu, Shenqi Xie, Oscar Vazquez Mena, Katrin Sidler Arnet, Wei Tang

Stencil lithography (SL) is a shadow mask based technique which allows parallel, resistless, micro- and nano-patterning of material through apertures in a membrane (stencil) onto a substrate [1]. The stencils are usually made of LPCVD low-stress SiN due to ...

Microelectronic Engineering2011

Robust PECVD SiC membrane made for stencil lithography

Jürgen Brugger, Andreea Veronica Savu, Shenqi Xie, Oscar Vazquez Mena, Katrin Sidler Arnet, Wei Tang

Stencil lithography (SL) is a shadow mask technique which allows parallel, resistless, micro- and nano- patterning of material through apertures created in a membrane (stencil) onto a substrate. The stencils are usually made of LPCVD low-stress SiN due to ...

Elsevier2011

Towards fabrication of Vertical Slit Field Effect Transistor (VeSFET) as new device for nano-scale CMOS technology

Jean-Michel Sallese, Didier Bouvet, Lucian Barbut

This paper proposes a CMOS based process for Vertical Slit Field Effect Transistors. The central part of the device, namely, the vertical slit, is defined by using electron beam lithography and silicon dry etching. In order to verify the validity and the r ...

IEEE2011

Reversing the shape transition of InAs/GaAs (001) quantum dots by etching-induced lateral In segregation

Klaus Kern, Theresa Lutz, Giovanni Costantini

The shape evolution of epitaxially grown InAs/GaAs(001) quantum dots after the controlled removal of material by an in situ etching gas is investigated by atomic force and scanning tunneling microscopy. The presence of {137} facets on the surface of partia ...

2010

Etching of sub-micrometer structures through Stencil

Jürgen Brugger, Luis Guillermo Villanueva Torrijo, Andreea Veronica Savu, Marc Antonius Friedrich van den Boogaart, Oscar Vazquez Mena, Katrin Sidler Arnet, Kristopher Pataky

Resistless processes to realize the pattern transfer of your designs into the substrate present some advantages, as the reduction in fabrication steps. Stencil Lithography (SL) is one of the most used resistless processes and, up to now, it has mainly been ...

2008

Fluorine based plasma treatment of biocompatible silicone elastomer. Effect of temperature on etch rate and surface properties

Arnaud Bertsch, Cyrille Hibert

This paper describes F-based dry etching and resulting surface properties of biocompatible silicone elastomer. The etch rate of polysiloxane and surface morphology was found to be highly temperature dependent. An increase in temperature results in a signif ...

2008

Characterization of the feature-size dependence in Ar/Cl2 chemically assisted ion beam etching of InP-based photonic crystal devices

Romuald Houdré, Rolando Ferrini

The authors address feature-size dependence in Ar/Cl2 chemically assisted ion beam etching (CAIBE) in the context of the fabrication of photonic crystal (PhC) structures. They systematically investigate the influence of various parameters such a ...

2007

Développement et étude d'une technique de microsablage à haute résolution

Anne-Gabrielle Pawlowski

We have used powder blasting as a technique to structure brittle materials like glass using an erosion resistant mask. The study of the erosion rate shows that the erosion of glass is maximum at a normal incidence of the powder beam while the erosion rate ...

EPFL2006

Polymer-based cantilevers with integrated electrodes

Jürgen Brugger, Giovanni Boero, Radivoje Popovic, Schahrazede-Lila Mouaziz

An innovative release method of polymer cantilevers with embedded integrated metal electrodes is presented. The fabrication is based on the lithographic patterning of the electrode layout on a wafer surface, covered by two layers of SU-8 polymer: a 10-um-t ...

Institute of Electrical and Electronics Engineers2006