Publications associées à High-efficiency non-ablative UV laser nano-scale processing of fused silica by stable filamentation

Advanced Silicon and SWIR Single-Photon Avalanche Diodes: Design, Simulation, and Characterization

Low-level light detection with high spatial and timing accuracy is a growing area of interest by virtue of applications such as light detection and ranging (LiDAR), biomedical imaging, time-resolved Raman spectroscopy, and quantum applications. Single-phot ...

EPFL2024

First developments towards producing inductive magnetic sensors using state-of-the-art photolithography techniques

Duccio Testa, Ambrine Douhane, Marcus Cemes

Inductive magnetic sensors are needed for tokamak operation to provide the low-frequency (LF) measurements leading to the equilibrium reconstruction and to monitor the higher frequency (HF) instabilities; the HF magnetic sensors are often also used as a ba ...

2023

Femtosecond laser-based optomechanical processes for permanent and high-precision fine alignment of optical systems

Saood Ibni Nazir

Miniaturization has been at the forefront of scientific research in the past decade covering diverse areas such as electronics, mechanics, and optics. While 'small is beautiful' may be a vast generalization, the true benefits of miniaturization are especia ...

EPFL2021

FABRICATION AND ANALYSIS OF THIN FILM LITHUM NIOBATE RESONATORS FOR 5GHz FREQUENCY AND LARGE k(t)(2) APPLICATIONS

Victor Plessky, Luis Guillermo Villanueva Torrijo, Seniz Esra Küçük, Soumya Yandrapalli

This work presents the fabrication and analysis of suspended thin film Lithium Niobate resonators. The yield of the new fabrication process presented below is >90% showing devices with high k(t)(2) of 28% resonators at 5GHz, making them suitable for high f ...

IEEE2021

The Michelangelo step: removing scalloping and tapering effects in high aspect ratio through silicon vias

Edoardo Charbon, Sandro Carrara, Simone Frasca, Rebecca Camilla Leghziel

We present here, for the first time, a fabrication technique that allows manufacturing scallop free, non-tapered, high aspect ratio in through-silicon vias (TSVs) on silicon wafers. TSVs are among major technology players in modern high-volume manufacturin ...

Nature Research2021

Enhanced-performance integrated Resonant Switched-Capacitor and Buck DC-DC converters for application in extreme radiation and magnetic field environments

Giacomo Ripamonti

DC-DC converters based on Application Specific Integrated Circuits (ASICs) have been developed in this doctoral work for the High-Luminosity Large Hadron Collider (HL-LHC) experiments at CERN. They step down the voltage from a 2.5 V line and supply a load ...

EPFL2020

High power ultraviolet LED illumination systems: coherence properties and applications in photolithography

Johana Bernasconi

Mask-aligner photolithography is a technology used to replicate patterns from a mask to a photosensitive substrate. It is widely used in the fabrication of MEMS and micro-optical components, and for other applications with dimensions in the micrometer rang ...

EPFL2018

High power modular LED-based illumination system for lithography applications

Hans Peter Herzig, Wilfried Noell, Marcel Groccia, Toralf Scharf, Johana Bernasconi, Raoul Kirner

Mask-aligner lithography is a technology used to transfer patterns with critical dimensions in the micrometer range from below 1 micron for contact printing to a dozen of microns in proximity printing. This technology is widely used in the fabrication of M ...

2018

Symmetry breakdown of electron emission in extreme ultraviolet photoionization of argon

David Ferdinand Scholz, Eugenio Ferrari, Philip Johannes Walter Moll

Short wavelength free-electron lasers (FELs), providing pulses of ultrahigh photon intensity, have revolutionized spectroscopy on ionic targets. Their exceptional photon flux enables multiple photon absorptions within a single femtosecond pulse, which in t ...

Nature Publishing Group2018

Compact laser-assisted tools for high-resolution additive manufacturing

Paul Delrot

Micro-additive manufacturing has become an enabling technology in biomedical research as it allows for instance creating functional microstructures or studying cellular interactions at the microscale. Among the various manufacturing techniques laser-actuat ...

EPFL2018

Three-dimensional microfabrication through a multimode optical fiber

Demetri Psaltis, Christophe Moser, Loïc Urio, Nicolino Stasio, Edgar Emilio Morales Delgado, Donald Benjaman Conkey

3D printing based on additive manufacturing is an advanced manufacturing technique that allows the fabrication of arbitrary macroscopic and microscopic objects. Many 3D printing systems require large optical elements or nozzles in proximity to the built st ...

Optical Soc Amer2017

The impact of sorbent geometry on the sulphur adsorption under supercritical water conditions: a numerical study

Andrea Testino, Christian Ludwig

A numerical model to show the impact of the adsorption bed geometry on the desulfurization process of wet biomass under supercritical water (SCW) gasification process has been developed. Three different geometries, straight channels (pipe), sharp-edged cha ...

Springer Heidelberg2017

A Deep Etching Mechanism for Trench-Bridging Silicon Nanowires

Yusuf Leblebici, Zuhal Tasdemir

Introducing a single silicon nanowire with a known orientation and dimensions to a specific layout location constitutes a major challenge. The challenge becomes even more formidable, if one chooses to realize the task in a monolithic fashion with an extrem ...

Institute of Physics2016

Fabrication defects and grating couplers in III-nitride photonic crystal nanobeam lasers (Conference Presentation)

Jean-François Carlin, Nicolas Grandjean, Raphaël Butté, Ian Michael Rousseau

We report a numerical and experimental investigation of fabrication tolerances and outcoupling in optically pumped III-nitride nanolasers operating near lambda = 460 nm, in which feedback is provided by a one-dimensional photonic crystal nanobeam cavity an ...

Spie-Int Soc Optical Engineering2016

Post-cmos processing and 3d integration based on dry-film lithography

Yusuf Leblebici, Yüksel Temiz, Carlotta Guiducci

A method for performing a post processing pattern on a diced chip having a foot-print, comprises the steps of providing a support wafer; applying a first dry film photoresist to the support wafer; positioning a mask corresponding to the footprint of the di ...

2015

Microfluidic Scintillation Detectors for High Energy Physics

Pietro Maoddi

This thesis deals with the development and study of microfluidic scintillation detectors, a technology of recent introduction for the detection of high energy particles. Most of the interest for such devices comes from the use of a liquid scintillator, whi ...

EPFL2015

In-plane fabrication of insulated gold-tip probes for electrochemical and force spectroscopy molecular experiments

Nico de Rooij, Terunobu Akiyama, Sebastian Gautsch, Peter Van der Wal, Yexian Wu

A new and versatile fabrication process of insulated gold tip probes for atomic force microscopy (AFM) is presented by Wu et al. (In-plane fabricated insulated gold-tip probe for electrochemical and molecular experiments, in: 2013 IEEE 26th International C ...

Elsevier2014

A Die-Level Post-CMOS Processing Protocol for Multi-Layer 3D Integration

Yusuf Leblebici, Clemens Benedict Nyffeler, Davide Sacchetto, Seniz Esra Küçük

In this work, a chip-level post-CMOS processing protocol for 3D integration is presented to achieve multilayer stacking. This protocol includes TSV formation on the top chip, bonding the chips on top of each other, and finally the electrical connection pro ...

2014

Encapsulated Low Frequency Vibrating Body Field Effect Resonator

Marion Hermersdorf

Resonators for time and frequency reference applications are essential elements found in most electronic devices surrounding us. The continuous minimization and ubiquitous distribution of such electronic devices and circuits demands for resonators of small ...

EPFL2013

Post-CMOS Processing and 3-D Integration Based on Dry-Film Lithography

Yusuf Leblebici, Yüksel Temiz, Carlotta Guiducci

This paper presents a chip-level postcomplementary metal oxide semiconductor (CMOS) processing technique for 3-D integration and through-silicon-via (TSV) fabrication. The proposed technique is based on dry-film lithography, which is a low-cost and simple ...

Ieee-Inst Electrical Electronics Engineers Inc2013